-
1مؤتمر
المؤلفون: Guo, Rui, Yin, Cheng, Mao, Dali, Li, Ming, Lv, Zhong, Chiu, Hope
المصدر: 2013 3rd IEEE CPMT Symposium Japan CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd. :1-4 Nov, 2013
Relation: 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)
-
2مؤتمر
المؤلفون: Zhang, Wenjing, Lu, Qin, Hang, Tao, Li, Ming, Mao, Dali
المصدر: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :259-263 Aug, 2012
Relation: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
-
3مؤتمر
المؤلفون: Wu, Ciyan, Feng, Xue, Cao, Haiyong, Ling, Huiqin, Li, Ming, Mao, Dali
المصدر: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :430-433 Aug, 2012
Relation: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
-
4مؤتمر
المؤلفون: Wu, Xuewei, Ding, Dongyan, Han, Bai, Mao, Dali
المصدر: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :1072-1075 Aug, 2012
Relation: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
-
5مؤتمر
المؤلفون: Zhao, Qinghua, Bi, Jinglin, Hu, Anmin, Li, Ming, Mao, Dali
المصدر: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :1226-1229 Aug, 2012
Relation: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
-
6مؤتمر
المؤلفون: Han, Bai, Ding, Dongyan, Zhou, Yanting, He, Yanping, Liu, Yuzhao, Li, Ming, Mao, Dali
المصدر: 2011 International Symposium on Advanced Packaging Materials (APM) Advanced Packaging Materials (APM), 2011 International Symposium on. :47-51 Oct, 2011
Relation: 2011 International Symposium on Advanced Packaging Materials (APM)
-
7مؤتمر
المؤلفون: Zhou, Yanting, Ding, Dongyan, Han, Bai, Yu, Yunhong, Sun, Xulin, Chevrel, Henri, Ying, Hua, Li, Ming, Mao, Dali
المصدر: 2011 International Symposium on Advanced Packaging Materials (APM) Advanced Packaging Materials (APM), 2011 International Symposium on. :122-128 Oct, 2011
Relation: 2011 International Symposium on Advanced Packaging Materials (APM)
-
8مؤتمر
المؤلفون: Ji, Chunhua, Ling, Huiqin, Li, Ming, Mao, Dali
المصدر: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. :1-4 Aug, 2011
Relation: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
-
9مؤتمر
المؤلفون: Bi, Jinglin, Hu, Anmin, Li, Ming, Mao, Dali
المصدر: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. :1-5 Aug, 2011
Relation: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
-
10مؤتمر
المؤلفون: Liu, Ting, Wang, Yiqing, Ding, Dongyan, Galuschki, Klaus-Peter, Hu, Yu, Gong, Yihua, Li, Ming, Mao, Dali
المصدر: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. :1-5 Aug, 2011
Relation: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
Full Text Finder