المؤلفون: Jun Luo, Shukai Guan, Bo Wan, Maogong Jiang, Guicui Fu

المصدر: IEEE Access, Vol 9, Pp 106270-106282 (2021)

مصطلحات موضوعية: IGBT power module, bonding wires crack degradation, cohesive zone model, multiscale model simulation, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9492076/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/b6174bb20e9c4516b99e8fe38eeebd42

المؤلفون: Yanruoyue Li, Guicui Fu, Bo Wan, Maogong Jiang, Weifang Zhang, Xiaojun Yan

المصدر: Applied Sciences, Vol 10, Iss 6, p 1951 (2020)

مصطلحات موضوعية: sac305, bga, low temperature, fracture failure, Technology, Engineering (General). Civil engineering (General), TA1-2040, Biology (General), QH301-705.5, Physics, QC1-999, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2076-3417/10/6/1951; https://doaj.org/toc/2076-3417

URL الوصول: https://doaj.org/article/8814a6fa92ea4992a9b5ef91e7156756

المؤلفون: Maogong Jiang, Guicui Fu, Danyan Wang, Dong Zhang

المصدر: 2015 Prognostics and System Health Management Conference (PHM) Prognostics and System Health Management Conference (PHM), 2015. :1-4 Oct, 2015

Relation: 2015 Prognostics and System Health Management Conference (PHM)

المؤلفون: XiaoMing Fan, JiaQi Zhang, ChengZhi Jiang, Jiang Li, HanTian Gu, MaoGong Jiang, BoHan Li, Hao Hu, ChengXi Liu

المصدر: 2022 4th International Conference on Frontiers Technology of Information and Computer (ICFTIC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7022cd15cf106563d6e1fd84d6f2c1e7
https://doi.org/10.1109/icftic57696.2022.10075121

المؤلفون: Chongyang Gu, Maogong Jiang, Peilei Li, Qianqian Lv, Bo Xiao, Wei Zhang

المصدر: 2022 IEEE International Conference on Advances in Electrical Engineering and Computer Applications (AEECA).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::93352e9fb9a30648ba5f49df072780f6
https://doi.org/10.1109/aeeca55500.2022.9918938

المؤلفون: Maogong Jiang, Qianqian Lv, Peilei Li, Hantian Gu, Chongyang Gu, Wei Zhang, Guicui Fu

المصدر: 2022 Prognostics and Health Management Conference (PHM-2022 London).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ad2d5473966f73942ca323df4f4d4781
https://doi.org/10.1109/phm2022-london52454.2022.00031

المؤلفون: Yanruoyue Li, Guicui Fu, Maogong Jiang, Bo Wan, Zhongqing Zhang

المصدر: IEEE Transactions on Electron Devices. 68:168-174

مصطلحات موضوعية: 010302 applied physics, Data processing, Computer science, Port (circuit theory), Insulated-gate bipolar transistor, AC power, Residual, 01 natural sciences, Automotive engineering, Electronic, Optical and Magnetic Materials, Data-driven, Power electronics, 0103 physical sciences, Junction temperature, Electrical and Electronic Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a04c0fce46cb04e9933098079341276c
https://doi.org/10.1109/ted.2020.3037266

المؤلفون: Chongyang Gu, Peilei Li, Haiming Zhang, Maogong Jiang, Yantu Mo, Wei Zhang

المصدر: 2021 IEEE International Conference on Emergency Science and Information Technology (ICESIT).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::03650b5b284674f795d5f6bea5d693ac
https://doi.org/10.1109/icesit53460.2021.9696817

المؤلفون: Bo Wan, Yanruoyue Li, Weifang Zhang, Xiaojun Yan, Guicui Fu, Maogong Jiang

المصدر: Applied Sciences, Vol 10, Iss 6, p 1951 (2020)
Applied Sciences
Volume 10
Issue 6

مصطلحات موضوعية: Materials science, 02 engineering and technology, low temperature, 01 natural sciences, lcsh:Technology, Stress (mechanics), lcsh:Chemistry, Printed circuit board, Brittleness, Ball grid array, sac305, 0103 physical sciences, General Materials Science, Composite material, Instrumentation, Joint (geology), lcsh:QH301-705.5, Electronic circuit, 010302 applied physics, Fluid Flow and Transfer Processes, lcsh:T, Process Chemistry and Technology, General Engineering, 021001 nanoscience & nanotechnology, fracture failure, lcsh:QC1-999, Computer Science Applications, lcsh:Biology (General), lcsh:QD1-999, lcsh:TA1-2040, Soldering, bga, Fracture (geology), 0210 nano-technology, lcsh:Engineering (General). Civil engineering (General), lcsh:Physics

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::91a91309ca78062da22f1c85aa47d0d3
https://www.mdpi.com/2076-3417/10/6/1951

المؤلفون: Guicui Fu, Maogong Jiang, Zhang Sujuan, Jiaxin Yuan

المصدر: Proceedings of the 30th European Safety and Reliability Conference and 15th Probabilistic Safety Assessment and Management Conference.

مصطلحات موضوعية: Materials science, Soldering, Thermal, Composite material, Electric coupling

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9e5cd395a107ae08f1c3c0c1c8864675
https://doi.org/10.3850/978-981-14-8593-0_5247-cd