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المؤلفون: S.C. Song, Giri Nallapati, Irfan Khan, Nader Nikfar, Bohan Yan, Miguel Miranda, Bruce Lim, Mali Nagarajan, Joon-Young Park, Vaishnav Srinivas, Reza Langari, Bharani Chava, Venu Sanaka, Venu Boynapalli, Paras Gupta, Shree Pandey, Biancun Xie, Peijie Feng, Jihong Choi, Titash Rakshit, Ravi Shenoy, Mahadev Nemani, Colin Verrilli, John Zhu, Jun Chen, Mark Nakamoto, Lily Zhao, Yangyang Sun, Francois Atallah, Jonghae Kim, Rashid Attar, Chidi Chidambaram
المصدر: 2021 IEEE International Electron Devices Meeting (IEDM).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::03992d931fb1f04b814d365a32acce6f
https://doi.org/10.1109/iedm19574.2021.9720530 -
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المؤلفون: Ahmer Syed, Mark Schwarz, Dongming He, Wei Zhao, Xuefeng Zhang, Lily Zhao, Wei Wang, Mark Nakamoto
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Thermal copper pillar bump, Strain energy release rate, Shear (sheet metal), Back end of line, Materials science, Shear force, Fracture mechanics, Direct shear test, Composite material, Failure mode and effects analysis
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6b8853bda1d55e28ca4938aac00fb355
https://doi.org/10.1109/ectc32862.2020.00048 -
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المؤلفون: Riko Radojcic, Karthikeyan Dhandapani, Ahmer Syed, Ron Lindley, Wei Zhao, Mark Schwarz, Mark Nakamoto, Vidhya Ramachandran, Urmi Ray, Aurel Gunterus, Brian Matthew Henderson
المصدر: International Symposium on Microelectronics. 2017:000325-000330
مصطلحات موضوعية: 010302 applied physics, Engineering, business.industry, 020208 electrical & electronic engineering, Electrical engineering, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Integrated circuit design, Chip, 01 natural sciences, law.invention, Printed circuit board, Particle board, law, 0103 physical sciences, Automotive Engineering, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Wafer testing, business, Wafer-level packaging, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7e234c9e8cbe22c1074d3a9857fb3c1f
https://doi.org/10.4071/isom-2017-wp11_048 -
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المؤلفون: Ehrenfried Zschech, Henrik Hovsepyan, Riko Radojcic, Valeriy Sukharev, Wei Zhao, Armen Kteyan, Jun-Ho Choy, Uwe Muehle, Mark Nakamoto
المساهمون: Publica
المصدر: Journal of Electronic Packaging. 139
مصطلحات موضوعية: Electron mobility, Materials science, Silicon, Plasma spectroscopy, Strain measurement, chemistry.chemical_element, 02 engineering and technology, Stress, Transistors, 01 natural sciences, law.invention, law, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electrical and Electronic Engineering, Electronic circuit, 010302 applied physics, business.industry, Transistor, Electrical engineering, 020206 networking & telecommunications, Chip, Computer Science Applications, Electronic, Optical and Magnetic Materials, chemistry, Mechanics of Materials, business, Simulation
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4b9748c9e9c2b18a1e5432da27e04eae
https://doi.org/10.1115/1.4036402 -
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المؤلفون: Wei Zhao, Mark Nakamoto, Riko Radojcic
المصدر: International Symposium on Microelectronics. 2012:001155-001161
مصطلحات موضوعية: Stress (mechanics), Engineering, Reliability (semiconductor), business.industry, Embedded system, Automotive Engineering, Wafer, Semiconductor device, Dimension (data warehouse), business, Chip, Mobile device, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a36cbad593f1356e1bba2528be94cb59
https://doi.org/10.4071/isom-2012-thp46 -
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المؤلفون: Chandra Sekhar Nimmagadda, Xiaoxia Wu, Wei Zhao, Yuan Xie, Ratibor Radojcic, Durodami J. Lisk, Mark Nakamoto, Matt Nowak, Shiqun Gu
المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 20:186-191
مصطلحات موضوعية: Engineering, Interconnection, Through-silicon via, business.industry, Static timing analysis, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit design, Capacitance, Hardware and Architecture, Power consumption, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Electrical and Electronic Engineering, business, Software
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المؤلفون: Ahmer Syed, Mark Nakamoto, Wei Zhao, Riko Radojcic, Karthikeyan Dhandapani, Wei Lin
المصدر: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001373-001393
مصطلحات موضوعية: Engineering, Analogue electronics, business.industry, Transistor, Three-dimensional integrated circuit, Chip, Reliability engineering, law.invention, Cracking, Residual stress, law, Electronic engineering, Electrical performance, Pharmacology (medical), Electronics, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3eb53160fb6b048261209e014a8a7dad
https://doi.org/10.4071/2012dpc-wa12 -
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المؤلفون: Ahmer Syed, Wei Zhao, Riko Radojcic, Karthikeyan Dhandapani, Wei Lin, Mark Nakamoto
المصدر: International Symposium on Microelectronics. 2012:001026-001033
مصطلحات موضوعية: Engineering, business.industry, Interface (computing), Process (computing), Three-dimensional integrated circuit, Cloud computing, Chip, Die (integrated circuit), Reliability engineering, Reliability (semiconductor), Embedded system, Automotive Engineering, Electronics, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5427d1c280a41003a08fdfbb2bbe2fcd
https://doi.org/10.4071/isom-2012-thp12 -
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المؤلفون: R. Radojcic, D. Perry, Mark Nakamoto
المصدر: IEEE Solid-State Circuits Magazine. 1:24-33
مصطلحات موضوعية: Engineering, business.industry, Process (engineering), Design flow, Integrated circuit, Integrated circuit design, Manufacturing engineering, law.invention, Design for manufacturability, Outsourcing, law, Software deployment, Technology integration, Electrical and Electronic Engineering, business
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المؤلفون: Wei Zhao, Riko Radojcic, Mark Nakamoto, Vidhya Ramachandran
المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Engineering, Hardware_MEMORYSTRUCTURES, Silicon, business.industry, chemistry.chemical_element, Integrated circuit design, Chip, Finite element method, Reliability engineering, law.invention, Stress (mechanics), chemistry, law, Electrical network, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Integrated circuit packaging, business, Mechanical reliability
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7e62db507234891f37ae3d7e68bf0fe9
https://doi.org/10.1109/ectc.2014.6897447