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1رسالة جامعية
المؤلفون: Mark Schwarz
المصدر: ProQuest LLC. 2023Ed.D. Dissertation, Seton Hall University.
Peer Reviewed: N
Page Count: 91
Descriptors: Public Schools, Academic Achievement, Institutional Characteristics, Educational Environment, Correlation, Positive Attitudes, Socioeconomic Influences, Mathematics Achievement, Mathematics Education
مصطلحات جغرافية: New Jersey
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المؤلفون: Maximilian-Friedrich Schiek, Steffen Mark Schwarz
المصدر: Liederkunde zum Evangelischen Gesangbuch. Heft 30 ISBN: 9783525503614
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::19b9677f5e980209f93a681fc71f82d3
https://doi.org/10.13109/9783666503610.76 -
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المؤلفون: Pavan Rajmane, Ahmer Syed, Mark Schwarz, Karthikeyan Dhandapani
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Interconnection, System in package, Reliability (semiconductor), business.industry, Computer science, Time to market, New product development, Electronics, business, Finite element method, Die (integrated circuit), Reliability engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::10f4da10e99d89af2230797a6a2cfd68
https://doi.org/10.1109/ectc32696.2021.00240 -
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المؤلفون: Steffen Mark Schwarz, Maximilian-Friedrich Schiek
المصدر: Liederkunde zum Evangelischen Gesangbuch. Heft 27
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b7f8ade80d9405b07a604ca0f5c17452
https://doi.org/10.13109/9783666500107.8 -
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المؤلفون: Ahmer Syed, Mark Schwarz, Dongming He, Wei Zhao, Xuefeng Zhang, Lily Zhao, Wei Wang, Mark Nakamoto
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Thermal copper pillar bump, Strain energy release rate, Shear (sheet metal), Back end of line, Materials science, Shear force, Fracture mechanics, Direct shear test, Composite material, Failure mode and effects analysis
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6b8853bda1d55e28ca4938aac00fb355
https://doi.org/10.1109/ectc32862.2020.00048 -
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المؤلفون: Riko Radojcic, Karthikeyan Dhandapani, Ahmer Syed, Ron Lindley, Wei Zhao, Mark Schwarz, Mark Nakamoto, Vidhya Ramachandran, Urmi Ray, Aurel Gunterus, Brian Matthew Henderson
المصدر: International Symposium on Microelectronics. 2017:000325-000330
مصطلحات موضوعية: 010302 applied physics, Engineering, business.industry, 020208 electrical & electronic engineering, Electrical engineering, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Integrated circuit design, Chip, 01 natural sciences, law.invention, Printed circuit board, Particle board, law, 0103 physical sciences, Automotive Engineering, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Wafer testing, business, Wafer-level packaging, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7e234c9e8cbe22c1074d3a9857fb3c1f
https://doi.org/10.4071/isom-2017-wp11_048 -
7دورية أكاديمية
المؤلفون: Ikju Park, Mark Schwarzländer, Sanford D. Eigenbrode, Bradley L. Harmon, Hariet L. Hinz, Urs Schaffner
المصدر: PeerJ, Vol 12, p e16813 (2024)
مصطلحات موضوعية: Mogulones borraginis, Houndstongue, Cynoglossum officinale, Pre-release risk assessment, Host selection behavior, Biocontrol, Medicine, Biology (General), QH301-705.5
وصف الملف: electronic resource
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المؤلفون: Ahmer Syed, Xuefeng Zhang, Yangyang Sun, Wei Wang, Mark Schwarz, Bill Stone, Lily Zhao, Lejun Wang
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Stress (mechanics), Thermal copper pillar bump, Materials science, Soldering, Delamination, Mechanical engineering, Chip, Failure mode and effects analysis, Flip chip, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bfbeb9ea224ab3d2c80bd4a21c1bde09
https://doi.org/10.1109/ectc.2019.00066 -
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المؤلفون: Ahmer Syed, Wei Wang, Yuling Niu, Karthik Dhandapani, Mark Schwarz, Zhijie Wang
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Work (thermodynamics), Observational error, Materials science, 02 engineering and technology, Molding (process), Epoxy, Deformation (meteorology), 021001 nanoscience & nanotechnology, 01 natural sciences, Finite element method, Substrate (building), visual_art, 0103 physical sciences, visual_art.visual_art_medium, Composite material, 0210 nano-technology, Shrinkage
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6490bf5a80763aa6e21a6791eb9a934a
https://doi.org/10.1109/ectc.2019.00129 -
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المؤلفون: Wei Wang, Lily Zhao, Dingyou Zhang, Ahmer Syed, David Fraser Rae, Milind P. Shah, Mark Schwarz, Jiantao Zheng, Yangyang Sun
المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, Passivation, Deformation (mechanics), Delamination, Fracture mechanics, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Stress (mechanics), 0103 physical sciences, Composite material, 0210 nano-technology, Radial stress, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::926f5a3852753c67b43d197ad91e6669
https://doi.org/10.1109/ectc.2018.00159