يعرض 1 - 10 نتائج من 1,638 نتيجة بحث عن '"Matsumae, A."', وقت الاستعلام: 1.11s تنقيح النتائج
  1. 1
    مؤتمر
    Template Stripping Process Combined With Polyimide and SiO2/Si Templates for Obtaining Smooth Au Surfaces

    المؤلفون: Koseki, Shogo, Ogino, Mika, Takeuchi, Kai, Thu, Le Hac Huong, Matsumae, Takashi, Takagi, Hideki, Kurashima, Yuichi, Tsuda, Takahiro, Tokuhisa, Tomoaki, Shimizu, Toshikazu, Higurashi, Eiji

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :129-130 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  2. 2
    مؤتمر
    Direct bonding of Germanium and Diamond substrates by reduction process

    المؤلفون: Minowa, Yuki, Matsumae, Takashi, Hayase, Masanori, Kurashima, Yuichi, Takagi, Hideki

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :119-120 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  3. 3
    تقرير
    Effects of 3 MeV Proton Irradiation on Superconductivity and CDW in 2H-NbSe2 Single Crystals

    المؤلفون: Li, Wenjie, Pyon, Sunseng, Yagi, Akiyoshi, Ren, Tong, Suyama, Masahiro, Wang, Jiachen, Matsumae, Takumi, Kobayashi, Yuto, Takahashi, Ayumu, Miyawaki, Daisuke, Tamegai, Tsuyoshi

    المصدر: J. Phys. Soc. Japan 92 (2023) 064701

    مصطلحات موضوعية: Condensed Matter - Superconductivity

    URL الوصول: http://arxiv.org/abs/2304.05030

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  4. 4
    مؤتمر
    Direct bonding of germanium and diamond substrates by hydrophilic bonding

    المؤلفون: Minowa, Yuki, Matsumae, Takashi, Hayase, Masanori, Kurashima, Yuichi, Takagi, Hideki

    المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :171-172 Apr, 2023

    Relation: 2023 International Conference on Electronics Packaging (ICEP)

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  5. 5
    مؤتمر
    Optimizing activation process for strong direct bonding between diamond and Si substrates

    المؤلفون: Okita, S., Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Hayase, M.

    المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :261-262 Apr, 2023

    Relation: 2023 International Conference on Electronics Packaging (ICEP)

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  6. 6
    دورية أكاديمية
    Regnase-1 downregulation promotes pancreatic cancer through myeloid-derived suppressor cell-mediated evasion of anticancer immunity

    المؤلفون: Okabe, Junya, Kodama, Takahiro, Sato, Yu, Shigeno, Satoshi, Matsumae, Takayuki, Daiku, Kazuma, Sato, Katsuhiko, Yoshioka, Teppei, Shigekawa, Minoru, Higashiguchi, Masaya, Kobayashi, Shogo, Hikita, Hayato, Tatsumi, Tomohide, Okamoto, ToruAff3, Aff4, Satoh, Takashi, Eguchi, Hidetoshi, Akira, ShizuoAff6, Aff7, Takehara, TetsuoAff1, IDs1304602302831w_cor18

    المصدر: Journal of Experimental & Clinical Cancer Research. 42(1)

    Find this article in full text from Springer Verlag. Find this article in full text from ProQuest Full Text Finder
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  7. 7
    مؤتمر
    Direct Bonding of Diamond and Si Substrates at Low Temperatures Under Atmospheric Conditions

    المؤلفون: Matsumae, Takashi, Kurashima, Yuichi, Umezawa, Hitoshi, Takagi, Hideki

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1436-1441 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Formation of smooth Au surfaces produced by multiple thin-film transfer process based on template stripping for low-temperature bonding

    المؤلفون: Higurashi, Eiji, Yamamoto, Michitaka, Nishimura, Ryutaro, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Suga, Tadatomo, Itoh, Toshihiro

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :223-228 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Heat Transfer Rates Mapping in The Brain based on DSC-MRI

    المؤلفون: Chewpanyanun, Werawat, Matsumae, Mitsunori, Horie, Tomohiko, Kagayaki, Kuroda

    المصدر: 2019 12th Biomedical Engineering International Conference (BMEiCON) Biomedical Engineering International Conference (BMEiCON), 2019 12th. :1-4 Nov, 2019

    Relation: 2019 12th Biomedical Engineering International Conference (BMEiCON)

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  10. 10
    مؤتمر
    Efficient heat dissipation from β-Ga2O3 film directly bonded on diamond substrate

    المؤلفون: Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Watanabe, H., Ito, T., Higurashi, E.

    المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :99-100 May, 2022

    Relation: 2022 International Conference on Electronics Packaging (ICEP)

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