المؤلفون: Raviol, J.^{Aff1, IDs1134002401049x_cor1}, Plet, G., Magoariec, H., Pailler-Mattei, C.^{Aff1, Aff2}

المصدر: Experimental Mechanics: An International Journal Integrating Experimental Methods with the Mechanical Behavior of Materials and Structures. 64(5):625-638

المؤلفون: Raviol, J., Plet, G., Hasegawa, R., Yu, K., Kosukegawa, H., Ohta, M., Magoariec, H., Pailler-Mattei, C.

المصدر: In Journal of the Mechanical Behavior of Biomedical Materials May 2024 153

المؤلفون: Oliva, MK, Bourke, J., Kornienko, D., Mattei, C., Mao, M., Kuanyshbek, A., Ovchinnikov, D., Bryson, A., Karle, TJ, Maljevic, S., Petrou, S.

المصدر: In Journal of Neuroscience Methods September 2024 409

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Alternate Title: Validation of the 13–30ARAMAV assessment, a new quality of life and autonomy questionnaire adapted to visually impaired patients (English)

المؤلفون: Jeanjean, L. ^*, Lucas, X.M., Daien, V., Chevallier, T., Daures, J.P., De Mattei, C., Dupeyron, G.

المصدر: In Journal Français d'Ophtalmologie October 2020 43(8):742-752

المؤلفون: Djaghloul, M. ^*, Abdouni, A., Thieulin, C., Pailler-Mattei, C.

المصدر: In Journal of the Mechanical Behavior of Biomedical Materials September 2020 109

المؤلفون: Mattei, C., Adler, L.

المصدر: 1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027) Ultrasonics Ultrasonics Symposium, 1999. Proceedings. 1999 IEEE. 1:549-552 vol.1 1999

Relation: 1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium

المؤلفون: Orso, B., Mattei, C., Arnaldi, D., Massa, F., Serafini, G., Plantone, D., Doglione, E., Grafman, J., Nobili, F., Pardini, M.

المصدر: In The American Journal of Geriatric Psychiatry July 2020 28(7):755-763

المؤلفون: Thieulin, C., Pailler-Mattei, C., Abdouni, A., Djaghloul, M., Zahouani, H.

المصدر: In Journal of the Mechanical Behavior of Biomedical Materials March 2020 103

المؤلفون: Evans, T., Bright, B., Mattei, C., Huemoeller, R.

المصدر: Proceedings 1997 International Conference on Multichip Modules Multichip modules Multichip Modules, 1997., International Conference on. :284-289 1997

Relation: Proceedings 1997 International Conference on Multichip Modules