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المؤلفون: Chin-Li Kao, Darko Popovic, T. Sze, James G. Mitchell, Jing Shi, Matthew Giere, Tsung-Yueh Tsai, Yi-Shao Lai, Bruce M. Guenin
المصدر: Microelectronics Reliability. 50:498-506
مصطلحات موضوعية: Very-large-scale integration, Engineering, Hardware_MEMORYSTRUCTURES, business.industry, Electrical engineering, Electronic packaging, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit, Proximity communication, Condensed Matter Physics, Chip, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, law, Hardware_INTEGRATEDCIRCUITS, System on a chip, Signal integrity, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Flip chip