يعرض 1 - 10 نتائج من 23 نتيجة بحث عن '"Mauromicale, Giuseppe"', وقت الاستعلام: 0.99s تنقيح النتائج
  1. 1
    مؤتمر
    Fast Liquid-to-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package

    المؤلفون: Amoroso, Davide Maria, Donetti, Luca, Schifano, Biagio, Sitta, Alessandro, Mauromicale, Giuseppe, Sequenzia, Gaetano, Messina, Angelo Alberto, Rundo, Francesco, Calabretta, Michele

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-8 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  2. 2
    مؤتمر
    Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module Under Several Operating Condition

    المؤلفون: Donetti, Luca, Sitta, Alessandro, Mauromicale, Giuseppe, Calabretta, Michele, Mauro, Stefano, Sequenzia, Gaetano

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-7 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  3. 3
    مؤتمر
    Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment

    المؤلفون: Musolino, Mattia, Mauromicale, Giuseppe, Amoroso, Davide Maria, Donetti, Luca, Sequenzia, Gaetano, Sitta, Alessandro, Messina, Angelo Alberto, Calabretta, Michele

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-5 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  4. 4
    مؤتمر
    Thermal Impedance Computation of a SiC Power Module for Traction Inverter in Electric Vehicle Applications

    المؤلفون: Mauromicale, Giuseppe, Sitta, Alessandro, Rundo, Francesco, Messina, Angelo Alberto, Calabretta, Michele

    المصدر: 2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE), 2023 AEIT International Conference on. :1-6 Jul, 2023

    Relation: 2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE)

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  5. 5
    مؤتمر
    Characterization and simulation of four bending test to estimate resin-copper adhesion

    المؤلفون: Sitta, Alessandro, Mauromicale, Giuseppe, Torrisi, Marco Alfio, Sequenzia, Gaetano, D'Arrigo, Giuseppe, Calabretta, Michele

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-5 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  6. 6
    مؤتمر
    The reliability challenge of SiC Power Modules in Automotive Applications

    المؤلفون: Calabretta, Michele, Sitta, Alessandro, Mauromicale, Giuseppe, Rundo, Francesco, Sequenzia, Gaetano, Messina, Angelo Alberto

    المصدر: 2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM) Advanced Semiconductor Devices and Microsystems (ASDAM), 2022 14th International Conference on. :1-4 Oct, 2022

    Relation: 2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)

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  7. 7
    كتاب إلكتروني
    Experimental Reliability Assessment of ACEPACK SMIT Power Module

    المؤلفون: Amoroso, Davide MariaAff15, Aff16, Schifano, BiagioAff15, Calabretta, MicheleAff16, Mauromicale, GiuseppeAff16, Sequenzia, GaetanoAff15

    المساهمون: Chaari, Fakher, Series EditorAff1, Gherardini, Francesco, Series EditorAff2, Aff14, Ivanov, Vitalii, Series EditorAff3, Haddar, Mohamed, Series EditorAff4, Cavas-Martínez, Francisco, Editorial Board MemberAff5, di Mare, Francesca, Editorial Board MemberAff6, Kwon, Young W., Editorial Board MemberAff7, Trojanowska, Justyna, Editorial Board MemberAff8, Xu, Jinyang, Editorial Board MemberAff9, Carfagni, Monica, editorAff10, Furferi, Rocco, editorAff11, Di Stefano, Paolo, editorAff12, Governi, Lapo, editorAff13

    المصدر: Design Tools and Methods in Industrial Engineering III : Proceedings of the Third International Conference on Design Tools and Methods in Industrial Engineering, ADM 2023, September 6–8, 2023, Florence, Italy, Volume 1. :433-440

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  8. 8
    مؤتمر
    Paralleling Silicon Carbide MOSFETs in Power Module for Traction Inverters: a Parametric Study

    المؤلفون: Sitta, Alessandro, Mauromicale, Giuseppe, Giuffrida, Vittorio, Manzitto, Alessandra, Papaserio, Marco, Cavallaro, Daniela, Bazzano, Gaetano, Renna, Marco, Rizzo, Santi Agatino, Calabretta, Michele

    المصدر: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 22nd International Conference on. :1-5 Apr, 2021

    Relation: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  9. 9
    مؤتمر
    Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package

    المؤلفون: Sitta, Alessandro, Mauromicale, Giuseppe, Sequenzia, Gaetano, Messina, Angelo Alberto, Renna, Marco, Calabretta, Michele

    المصدر: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 22nd International Conference on. :1-6 Apr, 2021

    Relation: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  10. 10
    مؤتمر
    Analysis of the impact of the operating parameters on the variation of the dynamic on-state resistance of GaN power devices

    المؤلفون: Mauromicale, Giuseppe, Rizzo, Santi A., Salerno, Nunzio, Susinni, Giovanni, Raciti, Angelo, Fusillo, Filadelfo, Palermo, Agatino, Scollo, Rosario

    المصدر: 2020 2nd IEEE International Conference on Industrial Electronics for Sustainable Energy Systems (IESES) Industrial Electronics for Sustainable Energy Systems (IESES), 2020 2nd IEEE International Conference on. 1:101-106 Sep, 2020

    Relation: 2020 2nd IEEE International Conference on Industrial Electronics for Sustainable Energy Systems (IESES)

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