المؤلفون: Krishna, A., Rohit Nudurupati, S., Chandana, D.G., Dwivedi, P., van Schaik, A., Mehendale, M., Thakur, C.S.

المصدر: IEEE Internet of Things Journal IEEE Internet Things J. Internet of Things Journal, IEEE. 11(14):24831-24845 Jul, 2024

المؤلفون: Mehendale, M., Antonelli, A., Mair, R., Mukundhan, P., Bogdanowicz, J., Charley, A.L., Leray, P., Yasin, F., Crotti, D.

المصدر: 2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2021 32nd Annual SEMI. :1-4 May, 2021

Relation: 2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

المؤلفون: Mehendale, M., Kotelyanskii, M., Mair, R., Mukundhan, P., Bogdanowicz, J., Teugels, L., Charley, A.L., Kuszewski, P.

المصدر: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2020 31st Annual. :1-6 Aug, 2020

Relation: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

المؤلفون: Mehendale, M., Alves, M., Mair, R., Dai, J., Mukundhan, P., Hollman, R., Best, K., Kotelyanskii, M.

المصدر: 2019 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2019 International. :1-6 Oct, 2019

Relation: 2019 International Wafer Level Packaging Conference (IWLPC)

المؤلفون: Mehendale, M., Chen, J., Dai, J., Mair, R., Kotelyanskii, M, Mukundhan, P., Murray, T. W.

المصدر: 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2019 30th Annual SEMI. :1-5 May, 2019

Relation: 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

المؤلفون: Manikandan, R.R., Singhal, V., Chauhan, R., Menezes, V., Mehendale, M.

المصدر: 2018 31st International Conference on VLSI Design and 2018 17th International Conference on Embedded Systems (VLSID) VLSID VLSI Design and 2018 17th International Conference on Embedded Systems (VLSID), 2018 31st International Conference on. :171-176 Jan, 2018

Relation: 2018 31st International Conference on VLSI Design and 2018 17th International Conference on Embedded Systems (VLSID)

المؤلفون: Mair, R., Kotelyanskii, M., Mehendale, M., Ru, X., Mukundhan, P., Kryman, T., Liebens, M., Van Huylenbroeck, S., Haensel, L., Miller, A., Beyne, E., Murray, T.

المصدر: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2016 27th Annual SEMI. :54-59 May, 2016

Relation: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

المؤلفون: Pupeikis, J., Hu, W., Willenberg, B., Mehendale, M., Antonelli, G.A., Phillips, C.R., Keller, U.

المصدر: In Photoacoustics February 2023 29

المؤلفون: Borkar, S., Kopetz, H., Iwai, H., Fujita, M., Nandy, S.K., Wei Zhao, Taneja, S., Rajski, J., Zebo Peng, Mitra, S., Mehendale, M.

المصدر: 2014 27th International Conference on VLSI Design and 2014 13th International Conference on Embedded Systems VLSI Design and 2014 13th International Conference on Embedded Systems, 2014 27th International Conference on. :xxxiv-xliv Jan, 2014

Relation: 2014 27th International Conference on VLSI Design

المؤلفون: Mehendale, M.

المصدر: 17th International Conference on VLSI Design. Proceedings. VLSI design VLSI Design, 2004. Proceedings. 17th International Conference on. :507-511 2004

Relation: Proceedings. 17th International Conference on VLSI Design