المؤلفون: Ravindran, R., Sadie, J. A., Scarberry, K. E., Yang, H. S., Bakir, M. S., McDonald, J. F., Meindl, J. D.

المصدر: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :1015-1020 Jun, 2010

Relation: 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

المؤلفون: Huang, G., Bakir, M. S., Naeemi, A., Meindl, J. D.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(5):852-859 May, 2012

المؤلفون: Bhavnagarwala, A., Kapoor, A., Meindl, J.

المصدر: 30th European Solid-State Device Research Conference Solid-State Device Research Conference, 2000. Proceeding of the 30th European. :472-475 2000

Relation: 30th European Solid-State Device Research Conference

المؤلفون: Thacker, H. D., Ogunsola, O. O., Muler, A. V., Meindl, J. D.

المصدر: IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 17(3):659-670 Jun, 2011

المؤلفون: Codrescu, L., Deb-Pant, M., Taha, T., Eble, J., Wills, S., Meindl, J.

المصدر: Proceedings 20th Anniversary Conference on Advanced Research in VLSI Advanced research in VLSI Advanced Research in VLSI, 1999. Proceedings. 20th Anniversary Conference on. :242-255 1999

Relation: Proceedings 20th Anniversary Conference on Advanced Research in VLSI

المؤلفون: Naeemi, A., Meindl, J. D.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 56(9):1822-1833 Sep, 2009

المؤلفون: Naeemi, A., Meindl, J. D.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 55(10):2574-2582 Oct, 2008

المؤلفون: Shakeri, K., Meindl, J. D.

المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 16(6):745-754 Jun, 2008

المؤلفون: Bakir, M. S., Glebov, A. L., Lee, M. G., Kohl, P. A., Meindl, J. D.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 31(1):143-153 Feb, 2008

المؤلفون: Bakir, M. S., Dang, B., Ogunsola, O. O. A., Sarvari, R., Meindl, J. D.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 54(9):2426-2437 Sep, 2007