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المؤلفون: Megan Brooks-Planck, Eden May, Michael Buttrick, Meng Yuan Li, Elizabeth Bonnell, Rebecca Johnson, Stephanie Williams
المصدر: Undergraduate Journal of Service Learning & Community-Based Research. 2:1-37
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ab3f1b50d4a27afb25e4dd28fedfe856
https://doi.org/10.56421/ujslcbr.v2i0.149 -
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المؤلفون: Sandip Kundu, Michael Buttrick
المصدر: DATE
مصطلحات موضوعية: Engineering, business.product_category, Wafer bonding, Computer science, business.industry, Clock rate, Stacking, Skew, Three-dimensional integrated circuit, Manufacturing cost, Synchronization, Die (integrated circuit), Clock network, Phase-locked loop, Embedded system, Delay-locked loop, Hardware_INTEGRATEDCIRCUITS, Die (manufacturing), Electrical and Electronic Engineering, business, Computer hardware, Single cycle
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المؤلفون: Michael Buttrick, Sandip Kundu
المصدر: ISVLSI
مصطلحات موضوعية: Interconnection, Engineering, business.industry, Integrated circuit design, Integrated circuit, Multiplexing, Die (integrated circuit), law.invention, law, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Overhead (computing), Routing (electronic design automation), business, Dram
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::80c17cb8becdea046c9e2608d9298e0e
https://doi.org/10.1109/isvlsi.2011.27