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1دورية أكاديمية
المؤلفون: Michael Schiffer
المصدر: Revista Chicomoztoc, Vol 1, Iss 1 (2019)
مصطلحات موضوعية: Divulgación, arqueología, comunidad arqueológica, Human ecology. Anthropogeography, GF1-900
وصف الملف: electronic resource
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المؤلفون: Piotr Mackowiak, Olaf Wittler, Tanja Braun, Kolia Erbacher, Michael Schiffer, Martin Schneider-Ramelow
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a4f09327e4a0034f70271a32e666bc1b
https://doi.org/10.1109/eptc56328.2022.10013212 -
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المؤلفون: Piotr Mackowiak, Olaf Wittler, Tanja Braun, Janine Conrad, Michael Schiffer, Martin Schneider-Ramelow
المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::30405ad6d017b4b8b1c7492627662356
https://doi.org/10.1109/estc55720.2022.9939379 -
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المؤلفون: Parnika Gupta, Padraic E. Morrissey, Peter O' Brien, Kevin Krohnert, Markus Wohrmann, Michael Schiffer, Christian Kelb, Norbert Ambrosius, Martin Schneider-Ramelow
المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::061d142f99f25742d59a57f69962c55c
https://doi.org/10.1109/estc55720.2022.9939531 -
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المؤلفون: Yucheng Zhang, Francesco Solozzi, Norbert Cselyuszka, Kurt Sorchag, Nikolai Andrianov, Manuel Bauscher, Michael Schiffer, Mohssen Moridi, Elmar Aschauer, Klaus-Dieter Lang, Martin Schneider-Ramelow
المصدر: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::aab5aae6761ee876506bc3bb6dca3817
https://doi.org/10.1109/dtip56576.2022.9911752 -
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المؤلفون: Markus Woehrmann, Piotr Mackowiak, Michael Schiffer, Klaus-Dieter Lang, Martin Schneider-Ramelow
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::99fe3d5795be50f294fb5dc82b9aaf8d
https://doi.org/10.1109/ectc51906.2022.00125 -
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المؤلفون: Piotr Mackowiak, Ha-Duong Ngo, Charles-Alix Manier, Michael Tvpper, Klaus-Dieter Lang, Kolja Erbacher, Martin Schneider-Ramelow, Michael Schiffer
المساهمون: Publica
مصطلحات موضوعية: Microelectromechanical systems, silicon carbide (SiC), Materials science, business.industry, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Monocrystalline silicon, chemistry.chemical_compound, chemistry, Etching (microfabrication), Micro electromechanical system (MEMS), Silicon carbide, Interposer, Optoelectronics, Wafer, Dry etching, Electrical and Electronic Engineering, business, Flip chip, through SiC via (TSiCV)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::07a8825d118f35a2ef434b86ee232963
https://publica.fraunhofer.de/handle/publica/434576 -
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المؤلفون: Ha-Duong Ngo, Manuel Bäuscher, Michael Schiffer, Dahiana Mojena Medinaa, José Luis Jorcano, Pablo Acedo, Raghied Mohammed Helmy Atta
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::25ac12889eb031c14ae82c845fac98a0
https://doi.org/10.1088/978-0-7503-3439-6ch14 -
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المؤلفون: Piotr Mackowiak, Kolja Erbacher, Manuel Baeuscher, Michael Schiffer, Klaus-Dieter Lang, Martin Schneider-Ramelow, Ha-Duong Ngo
المصدر: 2021 IEEE Sensors.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1a4cf4a585c5b50ea58e296536821f25
https://doi.org/10.1109/sensors47087.2021.9639506