المؤلفون: Joshi, Shailesh N., Yu, Ziqi, Sennoun, Hacin, Hampshire, Joseph, Dede, Ercan M.

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :790-795 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Nahum Y. Godi

المصدر: International Journal of Thermofluids, Vol 21, Iss , Pp 100559- (2024)

مصطلحات موضوعية: Complex cylindrical fins, Complex micro heat sink, Parallel flow, Counter flow, Heat, QC251-338.5

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2666202724000016; https://doaj.org/toc/2666-2027

URL الوصول: https://doaj.org/article/7427ef02c6bf47dd88eb652762c338ee

المؤلفون: Robinson, A.J., Tan, W., Kempers, R., Colenbrander, J., Bushnell, N., Chen, R.

المصدر: 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2017 33rd. :179-186 2017

Relation: 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

المؤلفون: Nahum Yustus Godi, L. B. Zhengwuvi, Moses Omolayo Petinrin

المصدر: Nigerian Journal of Technological Development, Vol 20, Iss 2 (2023)

مصطلحات موضوعية: Square configuration, circular configuration, micro heat sink, numerical optimisation, thermal conductance, Square configuration, circular configuration, micro heat sink, numerical optimisation, thermal conductance, Technology, Geophysics. Cosmic physics, QC801-809

وصف الملف: electronic resource

Relation: https://journal.njtd.com.ng/index.php/njtd/article/view/1272; https://doaj.org/toc/2437-2110

URL الوصول: https://doaj.org/article/a23b837ecf4f43898fef1a12190fafec

المؤلفون: Luo, Yi, Yu, Beike, Zhou, Chuanpeng, Wang, Xiaodong

المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :85-88 Aug, 2015

Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Luo, Yi, Yu, Beike, Shan, Qing, Wang, Xiaodong

المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :526-529 Aug, 2015

Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

المؤلفون: Allehiany, F. M., Mahmoud, Emad E., Berrouk, S.^{Aff3, Aff4}, Ali, Vakkar^{Aff5, IDs10973021108539_cor4}, Ibrahim, Muhammad^{Aff3, IDs10973021108539_cor5}

المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 145(3):1623-1632

المؤلفون: Ibrahim, Muhammad, Berrouk, Abdallah S.^{Aff1, Aff2}, Algehyne, Ebrahem A., Saeed, Tareq, Chu, Yu-Ming^{Aff5, Aff6}

المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 145(3):1547-1557

المؤلفون: Jasperson, B. A., Jeon, Y., Turner, K. T., Pfefferkorn, F. E., Qu, W.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 33(1):148-160 Mar, 2010