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المصدر: IEEE Access Access, IEEE. 12:21402-21419 2024

المؤلفون: Nachawi, Salam I., Gaudet, Vincent, Elmasry, Mohamed

المصدر: 2021 12th International Conference on Information, Intelligence, Systems & Applications (IISA) Information, Intelligence, Systems & Applications (IISA), 2021 12th International Conference on. :1-5 Jul, 2021

Relation: 2021 12th International Conference on Information, Intelligence, Systems & Applications (IISA)

المؤلفون: Thurmer, Clayton R., Ray, Jason D., Klein, Jordan D., Bunkley, Steven L., Netchaev, Anton, Patel, Reena R., Riveros, Guillermo A., Perkins, Edward J., Jeffery Hoover, Jan

المصدر: 2018 9th IEEE Annual Ubiquitous Computing, Electronics & Mobile Communication Conference (UEMCON) Ubiquitous Computing, Electronics & Mobile Communication Conference (UEMCON), 2018 9th IEEE Annual. :424-428 Nov, 2018

Relation: 2018 9th IEEE Annual Ubiquitous Computing, Electronics & Mobile Communication Conference (UEMCON)

المؤلفون: Barbarosou, Maria, Paraskevas, Ioannis, Kliros, George, Andreatos, Antonios

المصدر: 2017 IEEE Global Engineering Education Conference (EDUCON) Global Engineering Education Conference (EDUCON), 2017 IEEE. :423-430 Apr, 2017

Relation: 2017 IEEE Global Engineering Education Conference (EDUCON)

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المساهمون: Wang, K [Univ. of California, Los Angeles (United States)]

المصدر: Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States); 9:4; Conference: 37. national American Vacuum Society symposium, Toronto (Canada), 8-12 Oct 1990

وصف الملف: Medium: X; Size: Pages: 2064-2071

URL الوصول: http://www.osti.gov/scitech/biblio/7237670

المؤلفون: Rusev, R. P., Angelov, G. V., Takov, T. B., Hristov, M. H.

المصدر: 2009 MIXDES-16th International Conference Mixed Design of Integrated Circuits & Systems Mixed Design of Integrated Circuits & Systems, 2009. MIXDES '09. MIXDES-16th International Conference. :402-405 Jun, 2009

Relation: 2009 MIXDES-16th International Conference Mixed Design of Integrated Circuits & Systems (MIXDES)

المساهمون: Bufford, Daniel [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)]

وصف الملف: Medium: ED; Size: 28 p.

URL الوصول: http://www.osti.gov/scitech/servlets/purl/1331532

المساهمون: YAREMA, R

المصدر: Conference: 2007 INTERNATIONAL IMAGE SENSOR WORKSHOP; OGUNQUIT, ME; 20070607 through 20070610

وصف الملف: Medium: ED

URL الوصول: http://www.osti.gov/scitech/servlets/purl/909965

المساهمون: Iwayanagi, T [Hitachi Ltd., Tokyo (Japan)]

المصدر: Chemistry of Materials; (USA); 2:3

وصف الملف: Medium: X; Size: Pages: 299-305

URL الوصول: http://www.osti.gov/scitech/biblio/6715104