المؤلفون: Minjie Huang, Jufu Jiang, Ying Wang, Yingze Liu, Ying Zhang, Jian Dong, Jingbo Cui

المصدر: Materials & Design, Vol 237, Iss , Pp 112605- (2024)

مصطلحات موضوعية: Semi-solid HEA, Dual structured globules, Phase transition, Microstructural coarsening, CALPHAD, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S0264127523010213; https://doaj.org/toc/0264-1275

URL الوصول: https://doaj.org/article/cdda5a672e9f405abb14388599377f3d

المؤلفون: Kumar, P., Talenbanpour, B., Sahaym, U., Wen, C. H., Dutta, I.

المصدر: 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on. :880-887 May, 2012

Relation: 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Huang, Z., Kumar, P., Dutta, I., Subbarayan, G., Gupta, V., Chan, D., Wen, C. H.

المصدر: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on. :1-8 Jun, 2010

Relation: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Kumar, P., Huang, Z., Chavali, S. C., Chan, D. K., Dutta, I., Subbarayan, G., Gupta, V.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(2):256-265 Feb, 2012

المؤلفون: Hernando, Juan Carlos, Ghassemali, Ehsan, 1983, Diószegi, Attila, 1962

المصدر: Materials Characterization. 131:492-499

مصطلحات موضوعية: Dendrite fragmentation, Dendritic coarsening, EBSD, Microstructure evolution, Primary austenite, Austenite, Cast iron, Isotherms, Microstructure, Dendrite fragmentations, Electron backscatter diffraction technique, Micro-structure evolutions, Microstructural coarsening, Quantitative characterization, Secondary dendrite arm spacing, Coarsening

وصف الملف: electronic

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-36890
https://hj.diva-portal.org/smash/get/diva2:1133573/FULLTEXT01.pdf

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المؤلفون: Mulin Liu, Naoki Takata, Asuka Suzuki, Makoto Kobashi

المصدر: Materials, Vol 13, Iss 11, p 2487 (2020)

مصطلحات موضوعية: additive manufacturing, heat treatment process, aluminum alloy, portions of lattice structure, microstructural coarsening, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/13/11/2487; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/03c330ad8d2740e9a5c7796846188694

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المؤلفون: Makoto Kobashi, Mulin Liu, Naoki Takata, Asuka Suzuki

المصدر: Materials, Vol 13, Iss 2487, p 2487 (2020)
Materials
Volume 13
Issue 11

مصطلحات موضوعية: Equiaxed crystals, Materials science, Intermetallic, microstructural coarsening, Crystal structure, lcsh:Technology, Article, law.invention, law, Lattice (order), General Materials Science, Composite material, lcsh:Microscopy, Eutectic system, lcsh:QC120-168.85, Fusion, lcsh:QH201-278.5, lcsh:T, Microstructure, Laser, portions of lattice structure, heat treatment process, lcsh:TA1-2040, lcsh:Descriptive and experimental mechanics, lcsh:Electrical engineering. Electronics. Nuclear engineering, aluminum alloy, lcsh:Engineering (General). Civil engineering (General), additive manufacturing, lcsh:TK1-9971

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::436cc568d2fa37aeff22ec53b3c2ada4
https://www.mdpi.com/1996-1944/13/11/2487

المؤلفون: Dutta, I.

المصدر: Journal of Electronic Materials. April 2003 32(4):201-207