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المؤلفون: Maximiliano Ferrari, Travis Smith, Neil Shepard, Aditya Sundararajan, Drew Herron, Emilio Piesciorovsky, Isabelle Snyder, Ben Ollis, Josh Hambrick, Chris Sticht, Mike Marshall
المصدر: 2023 IEEE Power & Energy Society Innovative Smart Grid Technologies Conference (ISGT).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::93ae6b1e291c0130b1de3473588ba9b9
https://doi.org/10.1109/isgt51731.2023.10066421 -
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المؤلفون: Srijib Mukherjee, Mike Marshall, Travis Smith, Emilio Piesciorvosky, Isabelle Snyder, Chris Sticht
المصدر: 2022 IEEE Rural Electric Power Conference (REPC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d0003a2796bd07c313f2486167a2ab15
https://doi.org/10.1109/repec55671.2022.00013 -
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المؤلفون: Mike Marshall, Burhan Ali
المصدر: International Symposium on Microelectronics. 2019:000203-000210
مصطلحات موضوعية: Form factor (design), Automated optical inspection, business.industry, Computer science, Semiconductor device fabrication, Automotive Engineering, Process (computing), business, Chip, Computer hardware, Die (integrated circuit), Metrology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::02834f3877d9d6128aef4a75c4a358e7
https://doi.org/10.4071/2380-4505-2019.1.000203 -
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المؤلفون: Mike Marshall, Woo Han Young
المصدر: International Symposium on Microelectronics. 2019:000260-000267
مصطلحات موضوعية: Computer science, Automotive Engineering, Process control, Thread (computing), Reliability engineering, Shrinkage
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ec24da6efcc6c2df1dff100a9082556f
https://doi.org/10.4071/2380-4505-2019.1.000260 -
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المؤلفون: William C. Hunter, Mike Marshall, K. Gregg Elliott, Daniel S. Adams, Patrick J. Comer, Ryan Boyles, Don Faber-Langendoen, Dwayne Estes, Chris Doffitt, Alan S. Weakley, Matthew A. Albrecht, Jeffrey L. Walck, Jennifer M. Cartwright, Theo Witsell, JoVonn G. Hill, Reed F. Noss, Milo Pyne, Jason R. Singhurst, Wesley M. Knapp, Christopher Tracey
المصدر: Open-File Report.
مصطلحات موضوعية: Geography, geography.geographical_feature_category, Agroforestry, Grassland
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8c301bdcb5de65d1266afa13f8f63aa7
https://doi.org/10.3133/ofr20211047 -
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المؤلفون: Brad L. Boyce, Mike Marshall, Khalid Hattar, Henry A. Padilla, Eric Lang
المصدر: Microscopy and Microanalysis. 27:1492-1493
مصطلحات موضوعية: In situ, Materials science, chemistry, Chemical engineering, chemistry.chemical_element, Instrumentation, Copper, Nanocrystalline material
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المؤلفون: John Chang, Mike Marshall, Keith Best, Jian Lu
المصدر: 2019 International Wafer Level Packaging Conference (IWLPC).
مصطلحات موضوعية: Computer science, Feed forward, Fan-out, Overlay, Stepper, Error detection and correction, Grid, Lithography, Reliability engineering, Metrology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::84cebd23d8155753b1f30fd1cf7bf7b7
https://doi.org/10.23919/iwlpc.2019.8913865 -
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المؤلفون: Amy Shay, Woo Young Han, Mike Marshall, Bryan Selby
المصدر: 2019 International Wafer Level Packaging Conference (IWLPC).
مصطلحات موضوعية: business.product_category, Reliability (semiconductor), Semiconductor, Materials science, business.industry, Die (manufacturing), Mechanical engineering, Wafer, Electronics, Image sensor, business, Chip, Wafer-level packaging
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a4e1c3d85fc3322d2c7b8efc82a7929d
https://doi.org/10.23919/iwlpc.2019.8914148 -
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المؤلفون: Amy Shay, Mike Marshall, Jonathan Cohen, Keith Best, Gurvinder Singh, Woo Young Han
المصدر: International Symposium on Microelectronics. 2017:000584-000589
مصطلحات موضوعية: Residue (complex analysis), Semiconductor, Materials science, business.industry, Semiconductor device fabrication, Automotive Engineering, Miniaturization, Nanotechnology, Wafer, Photoresist, business, Lithography, Rapid detection
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9b3a7c732c88edab2c4ea784a9384532
https://doi.org/10.4071/isom-2017-tha36_058