يعرض 1 - 10 نتائج من 34 نتيجة بحث عن '"Ming, Xuefei"', وقت الاستعلام: 0.92s تنقيح النتائج
  1. 1
    مؤتمر
    Advanced Packaging of 3D Fan-out RF Microsystem for 5G IoT Communication

    المؤلفون: Xia, Chenhui, Wang, Hui, Wang, Gang, Ming, Xuefei

    المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

    Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

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  2. 2
    مؤتمر
    A Promising Embedded Silicon Fan-Out Wafer Level Package with Laser Releasable Temporary Bonding Technology

    المؤلفون: Wang, Chengqian, Zhang, Aibing, Li, Zhengfeng, Li, Shouwei, Li, Yang, Ji, Yong, Ming, Xuefei, Yu, Daquan

    المصدر: 2020 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2020 China. :1-4 Jun, 2020

    Relation: 2020 China Semiconductor Technology International Conference (CSTIC)

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  3. 3
    دورية أكاديمية
    X-ray detection of ceramic packaging chip solder defects based on improved YOLOv5

    المؤلفون: Li, Ke, Xu, Linhai, Su, Lei, Gu, Jiefei, Ji, Yong, Wang, Gang, Ming, Xuefei

    المصدر: In NDT and E International April 2024 143

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  4. 4
    مؤتمر
    Through glass via technology for ultra-high Q factor inductors

    المؤلفون: Zhou, Xiufeng, Ji, Yong, Cao, Yuyuan, Gao, Nayan, Wang, Jianfeng, Ming, Xuefei

    المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :215-218 Aug, 2018

    Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

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  5. 5
    مؤتمر
    Research on Key Process Technology of RDL-first Fan-out Wafer Level Packaging

    المؤلفون: Zhu, Jiachang, Ming, Xuefei, Yao, Xin

    المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :309-313 Aug, 2018

    Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

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  6. 6
    مؤتمر
    Design and Fabrication of the Silicon-based Integrated MIM Capacitors

    المؤلفون: Zhang, Rongzhen, Zhang, Qing, Zhou, Xiufeng, Zhu, Yetao, Ming, Xuefei, Gao, Nayan

    المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :280-283 Aug, 2018

    Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    Study of the fabrication and organization properties of copper-based Ba1−xSrxTiO3 composites

    المؤلفون: Li, Shouwei, Liang, Pei, Ming, Xuefei, Xiao, Zhiqiang

    المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :161-164 Aug, 2018

    Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    مؤتمر
    Effect of Chip Layout in Wafer on Molding and Fan-Out Wafer Level Packaging (FO-WLP) Technology

    المؤلفون: Li, Yang, Ming, Xuefei, Ji, Yong, Wu, Xin, Gao, Nayan, Wang, Bo

    المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :757-760 Aug, 2018

    Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    Warpage analysis of high-density FC-PBGA device during package process

    المؤلفون: Yao, Xin, Xiao, Zhiqiang, Ming, Xuefei, Cao, Yuyuan, Ji, Yong

    المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :219-222 Aug, 2018

    Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

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  10. 10
    دورية أكاديمية

    لا يتم عرض هذه النتيجة على الضيوف.

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