المؤلفون: Yu Hin Chan, Jang-Kyo Kim, Deming Liu, Peter Chou Kee Liu, Yiu Ming Cheung, Ming Wai Ng

المصدر: 2005 6th International Conference on Electronic Packaging Technology Electronics Packaging Technology Electronic Packaging Technology, 2005 6th International Conference on. :366-371 2005

Relation: 2005 6th International Conference on Electronics Packaging Technology

المؤلفون: Yu Hin Chan, Jang-Kyo Kim, Deming Liu, Liu, P.C.K., Yiu-Ming Cheung, Ming Wai Ng

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 28(4):674-684 Nov, 2005

المؤلفون: Ming Wai Ng, Yiu Ming Cheung, P.C.K. Liu, Yu Hin Chan, Jang Kyo Kim, Deming Liu

المصدر: Journal of Materials Science: Materials in Electronics. 19:281-288

مصطلحات موضوعية: Wire bonding, Materials science, business.product_category, Transductor, Bond strength, Low frequency, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Wedge (mechanical device), Electronic, Optical and Magnetic Materials, Printed circuit board, Q factor, Drop (telecommunication), Electrical and Electronic Engineering, Composite material, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::89a7f67bccca701571ee304b046f3f86
https://doi.org/10.1007/s10854-007-9312-7

المؤلفون: P.C.K. Liu, Ming Wai Ng, Yu Hin Chan, Jang Kyo Kim, Yiu Ming Cheung, Deming Liu

المصدر: IEEE Transactions on Advanced Packaging. 28:674-684

مصطلحات موضوعية: Wire bonding, Interconnection, Materials science, Plasma cleaning, Plating, Metallurgy, Process window, Electrolyte, Electrical and Electronic Engineering, Durability, Surface energy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0c9be6389b41776441252f635e914c9c
https://doi.org/10.1109/tadvp.2005.853548

المؤلفون: Deming Liu, Yu Hin Chan, Jang Kyo Kim, Yiu Ming Cheung, P.C.K. Liu, Ming Wai Ng

المصدر: Journal of Electronic Materials. 33:146-155

مصطلحات موضوعية: Wire bonding, Materials science, Scanning electron microscope, Metallurgy, Electrolyte, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Printed circuit board, Transition metal, Plating, Materials Chemistry, Process window, Electrical and Electronic Engineering, Deformation (engineering)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7dde1ecfc479254510d0e531ef494a17
https://doi.org/10.1007/s11664-004-0285-5

المؤلفون: Chi-Po Chong, Kelvin Ming-Wai Ng, Paul Wing-Po Chu, Helen Lai Wa Chan, P.C.K. Liu

المصدر: Microelectronic Engineering. 66:750-759

مصطلحات موضوعية: Frequency response, Wire bonding, Materials science, Acoustics, Smart transducer, Condensed Matter Physics, Lead zirconate titanate, Piezoelectricity, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, Transducer, chemistry, Electrode, Harmonic, Electrical and Electronic Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7c1565323524115939628c5e27717199
https://doi.org/10.1016/s0167-9317(02)00995-4

المؤلفون: Kelvin Ming-Wai Ng, Hing-Leung Li, Paul Wing-Po Chu, Helen Lai Wa Chan, P.C.K. Liu

المصدر: Materials Chemistry and Physics. 75:95-100

مصطلحات موضوعية: Wire bonding, Materials science, Transductor, Acoustics, Bandwidth (signal processing), Smart transducer, Condensed Matter Physics, Lead zirconate titanate, chemistry.chemical_compound, Transducer, chemistry, ComputerApplications_MISCELLANEOUS, Electrode, Hardware_INTEGRATEDCIRCUITS, ComputerSystemsOrganization_SPECIAL-PURPOSEANDAPPLICATION-BASEDSYSTEMS, General Materials Science, Ultrasonic sensor

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7a192f0e1426dfea3a4808dfd4f4f3fe
https://doi.org/10.1016/s0254-0584(02)00038-x

المؤلفون: Shakeel Usmani, Jennifer Ming Wai Ng, Felicia Mualim, Ana Costea, Romus Lamothe, Albert Hwang, Tennyson Smith, Ting Jia Tu, Paul Johnston, Daniel Hsiang Wei, Getaw Worku Hassen, Hossein Kalantari, Lydia Liyun Liu

المصدر: The Journal of emergency medicine. 45(4)

مصطلحات موضوعية: Adult, Male, medicine.medical_specialty, Exacerbation, Angiotensin-Converting Enzyme Inhibitors, Gastroenterology, Internal medicine, medicine, Humans, Aged, Retrospective Studies, Angioedema, biology, business.industry, Complement C1q, Angioedemas, Hereditary, Angiotensin-converting enzyme, Retrospective cohort study, Complement C4, Middle Aged, medicine.disease, Immune complex, Enzyme inhibitor, Hereditary angioedema, Immunology, Emergency Medicine, biology.protein, Disease Progression, Female, medicine.symptom, Esterase inhibitor, business, Complement C1 Inhibitor Protein

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c15241566323f7e9f4f47319694ac9bb
https://pubmed.ncbi.nlm.nih.gov/23890533

المؤلفون: Helen L. W. Chan, F. C. H. Yiu, Kelvin Ming-Wai Ng, P.C.K. Liu, Wan Ping Chen

المصدر: Applied Physics Letters. 80:3587-3589

مصطلحات موضوعية: Materials science, Physics and Astronomy (miscellaneous), Electrolysis of water, Hydrogen, chemistry.chemical_element, Lead zirconate titanate, Redox, Piezoelectricity, chemistry.chemical_compound, Chemical engineering, chemistry, Electrode, Degradation (geology), Dielectric loss

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b9efa37615c8f69821d6ddf8e2f4097a
https://doi.org/10.1063/1.1479205

المؤلفون: Deming Liu, Jang Kyo Kim, Yiu Ming Cheung, Yu Hin Chan, P.C.K. Liu, Ming Wai Ng

المصدر: 2005 6th International Conference on Electronic Packaging Technology.

مصطلحات موضوعية: Wire bonding, Interconnection, Engineering drawing, Materials science, Plasma cleaning, Anodic bonding, Ball grid array, Ball bonding, Process window, Composite material, Polyimide

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::38b6109c92fdb2af9e6ae4031e274472
https://doi.org/10.1109/icept.2005.1564609