المؤلفون: Mizushima, Ayako, Misumi, Kei, Yasunaga, Shun, Higo, Akio, Nakane, Ryosho, Tsumura, Kazumichi, Higashi, Kazuyuki, Ochiai, Yukinori, Mita, Yoshio

المصدر: 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2024 IEEE 36th International Conference on. :1-4 Apr, 2024

Relation: 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS)

المؤلفون: Yasunaga, Shun, Misumi, Kei, Mizushima, Ayako, Toyokura, Atsushi, Ota, Etsuko, Inoue, Yurie, Fujiwara, Makoto, Kawai, Noriko, Yoda, Mitsuhiro, Tsuboi, Shinji, Sawamura, Tomoki, Higo, Akio, Nakane, Ryosho, Ochiai, Yukinori, Mita, Yoshio

المصدر: 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2024 IEEE 36th International Conference on. :1-4 Apr, 2024

Relation: 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS)

المؤلفون: Shimamura, Ryugo, Misumi, Kei, Yasunaga, Shun, Higo, Akio, Nakane, Ryosho, Mita, Yoshio

المصدر: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :687-690 Jan, 2024

Relation: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Yasunaga, Shun, Ezawa, Motohiko, Tsuji, Keigo, Misumi, Kei, Sawamura, Tomoki, Tsuboi, Shinji, Mizushima, Ayako, Ochiai, Yukinori, Higo, Akio, Mita, Yoshio

المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :453-456 Jun, 2023

Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

المؤلفون: Shimamura, Ryugo, Yasunaga, Shun, Misumi, Kei, Eiler, Anne-Claire, Higo, Akio, Hwang, Gilgueng, Mizushima, Ayako, Zhu, Dongchen, Komori, Kikuo, Sakai, Yasuyuki, Toshiyoshi, Hiroshi, Tixier-Mita, Agnes, Mita, Yoshio

المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :2014-2017 Jun, 2023

Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

المؤلفون: Okamoto, Yuki, Makimoto, Natsumi, Misumi, Kei, Kobayashi, Takeshi, Mita, Yoshio, Ichiki, Masaaki

المصدر: 2023 35th International Conference on Microelectronic Test Structure (ICMTS) Microelectronic Test Structure (ICMTS), 2023 35th International Conference on. :1-4 Mar, 2023

Relation: 2023 35th International Conference on Microelectronic Test Structure (ICMTS)

المؤلفون: Misumi, Kei, Usami, Naoto, Higo, Akio, Ulliac, Gwenn, Piranda, Benoit, Bourgeois, Julien, Mita, Yoshio

المصدر: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2022 Symposium on. :1-4 Jul, 2022

Relation: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Yamaguchi, Takafumi, Usami, Naoto, Misumi, Kei, Toyokura, Atsushi, Higo, Akio, Ono, Shimpei, Hwang, Gilgueng, Larrieu, Guilhem, Ikeuchi, Yoshiho, Tixier-Mita, Agnes, Saito, Ken, Levi, Timothee, Mita, Yoshio

المصدر: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) SSolid-State Sensors, Actuators and Microsystems (Transducers), 2021 21st International Conference on. :18-21 Jun, 2021

Relation: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

المؤلفون: Misumi, Kei, Ulliac, Gwenn, Usami, Naoto, Piranda, Benoit, Mita, Yoshio, Higo, Akio, Bourgeois, Julien

المصدر: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2020 Symposium on. :1-4 Jun, 2020

Relation: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

المؤلفون: Hwang, Gilgueng, Mizushima, Ayako, Lebrasseur, Eric, Misumi, Kei, Usami, Naoto, Higo, Akio, Mita, Yoshio

المصدر: In Sensors and Actuators: A. Physical 1 February 2021 318