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المؤلفون: W. Choi, D. Yim, Klaus-Dieter Roeth, Mohammad M. Daneshpanah, E. Kwon, Frank Laske, S. Kim, M. Ferber, Y. Lee
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Engineering, International Technology Roadmap for Semiconductors, Optics, business.industry, Line (geometry), Hardware_INTEGRATEDCIRCUITS, Wafer, Node (circuits), Overlay, business, Dram, Immersion lithography, Metrology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cf16dd09391acfd56786d181924e7751
https://doi.org/10.1117/12.2202818 -
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المؤلفون: H. Yamaguchi, Mark Wagner, K. Kanno, Hideyoshi Takamizawa, Nobuaki Fujii, Klaus-Dieter Roeth, Mohammad M. Daneshpanah, Slawomir Czerkas, Shingo Yoshikawa, Frank Laske
المصدر: SPIE Proceedings.
مصطلحات موضوعية: International Technology Roadmap for Semiconductors, Engineering, Optics, Optical proximity correction, business.industry, Feature (computer vision), Hardware_INTEGRATEDCIRCUITS, Wafer, Overlay, business, Immersion lithography, Die (integrated circuit), Metrology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3229d4d2579339e43700c8ef204fbe12
https://doi.org/10.1117/12.2072074 -
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المؤلفون: Klaus-Dieter Roeth, Mohammad M. Daneshpanah, Hsien-Min Chang, William Chou, M. Ferber, R. Chiang, Slawomir Czerkas, Chao Yin Chen, S. Klein, Frank Laske, Mark Wagner
المصدر: Metrology, Inspection, and Process Control for Microlithography XXVIII.
مصطلحات موضوعية: Optics, business.industry, Computer science, Hardware_INTEGRATEDCIRCUITS, Wafer, Overlay, business, Field (computer science), Immersion lithography
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a93aaebbcc8660fcbce502567374555e
https://doi.org/10.1117/12.2049000 -
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المؤلفون: A. Fuse, M. Ferber, H. Sakaguchi, Klaus-Dieter Roeth, Mohammad M. Daneshpanah, Frank Laske, Slawomir Czerkas, Tatsuhiko Kamibayashi, Mark Wagner, M. Yamana, S. Kunitani
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Engineering, Engineering drawing, business.industry, Overlay, Die (integrated circuit), Metrology, International Technology Roadmap for Semiconductors, Hardware_INTEGRATEDCIRCUITS, Reticle, Wafer, Photomask, business, Computer hardware, Immersion lithography
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::30f114c9c870cbc951758b6ab31ff689
https://doi.org/10.1117/12.2027200