المؤلفون: Kumar, Annie, Yadav, Sachin, Vais, Abhitosh, Boccardi, Guillaume, Mols, Yves, Alcotte, Reynald, Parvais, Bertrand, Kunert, Bernardette, Collaert, Nadine

المصدر: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024 Microwave Symposium - IMS 2024, 2024 IEEE/MTT-S International. :940-943 Jun, 2024

Relation: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

المؤلفون: Mols, Nick M. L.^{Aff1, IDs0000402400767y_cor1}, Pezzica, Camilla

المصدر: Nexus Network Journal: Architecture and Mathematics. 26(3):531-556

المؤلفون: David, Charles, Beijer, Sandra, Mols, Floortje^{Aff1, Aff2}, Oerlemans, Simone, Husson, Olga^{Aff3, Aff4, Aff5}, Weijenberg, Matty P, Ezendam, Nicole PM^{Aff1, Aff2, IDs1176402401641z_cor7}

المصدر: Journal of Cancer Survivorship: Research and Practice. :1-16

المؤلفون: Bonhof, Cynthia S.^{Aff1, Aff2}, de Rooij, Belle H.^{Aff1, Aff2}, Schoormans, Dounya^{Aff1, Aff2}, Wasowicz, Dareczka K., Vreugdenhil, Gerard, Mols, Floortje^{Aff1, Aff2, IDs11764024016160_cor6}

المصدر: Journal of Cancer Survivorship: Research and Practice. :1-11

المؤلفون: Inge Schjødt, Rikke E. Mols, István Bakos, Erzsébet Horváth‐Puhó, Finn Gustafsson, Søren L. Kristensen, Johan E. Larsson, Bo Christensen, Hans Eiskjær, Brian B. Løgstrup

المصدر: ESC Heart Failure, Vol 11, Iss 4, Pp 1919-1931 (2024)

مصطلحات موضوعية: Cohort study, Health care utilization, Heart failure, Left ventricular assist device, Multimorbidity, Socio‐economic factors, Diseases of the circulatory (Cardiovascular) system, RC666-701

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2055-5822

URL الوصول: https://doaj.org/article/0d195e54760f4697ab3fd7b4034d2173

المؤلفون: Vais, A., Yadav, S., Mols, Y., Vermeersch, B., Kodandarama, K. V., Baryshnikova, M., Mannaert, G., Alcotte, R., Boccardi, G., Wambacq, P., Parvais, B., Langer, R., Kunert, B., Collaert, N.

المصدر: ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2022 - IEEE 52nd European. :261-264 Sep, 2022

Relation: ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC)

المؤلفون: Pezzica, Camilla^Aff8, Chioni, Chiara^Aff9, Mols, Nick M. L.^Aff8

المساهمون: Ribeiro, Diogo, Series Editor^Aff1, Naser, M. Z., Series Editor^Aff2, Stouffs, Rudi, Series Editor^Aff3, Bolpagni, Marzia, Series Editor^Aff4, Giordano, Andrea, editor^Aff5, Russo, Michele, editor^Aff6, Spallone, Roberta, editor^Aff7

المصدر: Advances in Representation : New AI- and XR-Driven Transdisciplinarity. :675-690

المؤلفون: Parvais, B., Vais, A., Yadav, S., Mols, Y., Vermeersch, B., Kodanarama, K. Vondkar, Boccardi, G., Kunert, B., Collaert, N.

المصدر: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2022 6th IEEE. :250-252 Mar, 2022

Relation: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

المؤلفون: Linåker, Johan, Munir, Hussan, Wnuk, Krzysztof, Mols, Carl-Eric

مصطلحات موضوعية: Computer Science - Software Engineering

URL الوصول: http://arxiv.org/abs/2208.00308

المؤلفون: Vais, A., Hsu, B., Syshchyk, O., Yu, H., Alian, A., Mols, Y., Kodandarama, K. V., Kunert, B., Waldron, N., Simoen, E., Collaert, N.

المصدر: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-5 Mar, 2021

Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)