المؤلفون: Ernesto Quisbert-Trujillo, Panagiota Morfouli

المصدر: Discover Internet of Things, Vol 3, Iss 1, Pp 1-19 (2023)

مصطلحات موضوعية: Internet of Things, IoT, IoT systems, Sensor systems, Sensor data, Life Cycle Assessment, Computer engineering. Computer hardware, TK7885-7895, Computer software, QA76.75-76.765

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2730-7239

URL الوصول: https://doaj.org/article/d95f151bd2b944a6ac53bbb490f8dcf2

المؤلفون: Quisbert-Trujillo, Ernesto^{Aff1, IDs43926023000514_cor1}, Morfouli, Panagiota

المصدر: Discover Internet of Things. 3(1)

المؤلفون: Montes, L., Xu, X., Potie, A., Bercu, B., Hinchet, R., Rochette, F., Ardila, G., Morfouli, P., Mouis, M., Songmuang, R., Salem, B., Baron, T.

المصدر: 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) Semiconductor Conference Dresden-Grenoble (ISCDG), 2012 International. :69-74 Sep, 2012

Relation: 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) - formerly known as the Semiconductor Conference Dresden (SCD)

المؤلفون: Lefevre, R., Salette, A., Montes, L., Morfouli, P., Dehan, C.

المصدر: 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) Semiconductor Conference Dresden-Grenoble (ISCDG), 2012 International. :195-198 Sep, 2012

Relation: 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) - formerly known as the Semiconductor Conference Dresden (SCD)

المؤلفون: Bercu, B., Montes, L., Morfouli, P.

المصدر: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on. :1-6 2006

Relation: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems

المؤلفون: Janioud, P., Poulain, C., Koumela, A., Armani, J.M., Dupret, A., Rey, P., Berthelot, A., Jourdan, G., Morfouli, P.

المصدر: In Microelectronics Reliability November 2020 114

المؤلفون: Montes, L., Morfouli, P.

المصدر: 2007 IEEE International Conference on Microelectronic Systems Education (MSE'07) Microelectronic Systems Education, 2007. MSE '07. IEEE International Conference on. :155-156 Jun, 2007

Relation: 2007 IEEE International Conference on Microelectronic Systems Education

المؤلفون: Vogel, E.M., Hill, W.L., Misra, V., McLarty, P.K., Wortman, J.J., Hauser, J.R., Morfouli, P., Ghibaudo, G., Ouisse, T.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 43(5):753-758 May, 1996

المؤلفون: Morfouli, P., Ghibaudo, G., Ouisse, T., Vogel, E.M., Hill, W.L., Misra, V., McLarty, P., Wortman, J.J.

المصدر: ESSDERC '95: Proceedings of the 25th European Solid State Device Research Conference Solid State Device Research Conference, 1995. ESSDERC '95. Proceedings of the 25th European. :247-250 Sep, 1995

Relation: Proceedings of the 25th European Solid State Device Research Conference

المؤلفون: Morfouli, P., Ghibaudo, G., Ouisse, T., Vogel, E., Hill, W., Misra, V., McLarty, P., Wortman, J.J.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 17(8):395-397 Aug, 1996