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1دورية أكاديمية
المؤلفون: Caillaud, R., Buttay, C., Mrad, R., Le Lesle, J., Morel, F., Degrenne, N., Mollov, S.V.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(2):230-239 Feb, 2020
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2دورية أكاديمية
المؤلفون: Ferber, M., Mrad, R., Morel, F., Pillonnet, G., Vollaire, C., Nagari, A.
المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 60(6):1811-1818 Dec, 2018
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3مؤتمر
المؤلفون: Kulkarni, V., Ben-Mrad, R., Prasad, S. Eswar
المصدر: IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society Industrial Electronics Society, IECON 2015 - 41st Annual Conference of the IEEE. :003434-003436 Nov, 2015
Relation: IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society
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4دورية أكاديمية
المؤلفون: Bani Milhim, A., Ben-Mrad, R.
المصدر: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 25(2):320-325 Apr, 2016
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5مؤتمر
المؤلفون: Schertzer, M. J., Blume, S., Badawi, A., Ben-Mrad, R., Sullivan, P.E.
المصدر: 2nd Middle East Conference on Biomedical Engineering Biomedical Engineering (MECBME), 2014 Middle East Conference on. :325-328 Feb, 2014
Relation: 2014 Middle East Conference on Biomedical Engineering (MECBME)
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6مؤتمر
المؤلفون: Khan, I., Chong, J., Ben Mrad, R., He, S., Schertzer, M. J.
المصدر: IECON 2012 - 38th Annual Conference on IEEE Industrial Electronics Society. :3987-3990 Oct, 2012
Relation: IECON 2012 - 38th Annual Conference of IEEE Industrial Electronics
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7مؤتمر
المؤلفون: Adami, S-E., Mrad, R., Morel, F., Vollaire, C., Pillonnet, G., Cellier, R.
المصدر: 2011 8th Workshop on Electromagnetic Compatibility of Integrated Circuits Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2011 8th Workshop on. :142-147 Nov, 2011
Relation: 2011 8th Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
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8دورية أكاديمية
المؤلفون: Kulkarni, V., Ben-Mrad, R., Prasad, S. E., Nemana, S.
المصدر: IEEE/ASME Transactions on Mechatronics IEEE/ASME Trans. Mechatron. Mechatronics, IEEE/ASME Transactions on. 19(3):801-807 Jun, 2014
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9دورية أكاديمية
المؤلفون: Mrad, R., Morel, F., Pillonnet, G., Vollaire, C., Lombard, P., Nagari, A.
المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 55(6):1169-1177 Dec, 2013
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10دورية أكاديمية
المؤلفون: Ahamed, M. J., Ben-Mrad, R., Sullivan, P.
المصدر: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 22(3):536-541 Jun, 2013