المؤلفون: Mulloni, V., Marchi, G., Di Ruzza, B., Donelli, M., Quaranta, A.

المصدر: 2024 47th MIPRO ICT and Electronics Convention (MIPRO) MIPRO ICT and Electronics Convention (MIPRO), 2024 47th. :1660-1664 May, 2024

Relation: 2024 47th MIPRO ICT and Electronics Convention (MIPRO)

المؤلفون: Marchi, G., Zanazzi, E., Mulloni, V., Donelli, M., Lorenzelli, L.

المصدر: IEEE Journal on Flexible Electronics IEEE Flex. Electron. Flexible Electronics, IEEE Journal on. 2(2):145-152 Mar, 2023

المؤلفون: Mulloni, V., Resta, G., Giacomozzi, F., Margesin, B.

المصدر: 2015 XVIII AISEM Annual Conference AISEM Annual Conference, 2015 XVIII. :1-4 Feb, 2015

Relation: 2015 XVIII AISEM Annual Conference

المؤلفون: Giacomozzi, F., Mulloni, V., Resta, G., Margesin, B.

المصدر: 2015 XVIII AISEM Annual Conference AISEM Annual Conference, 2015 XVIII. :1-4 Feb, 2015

Relation: 2015 XVIII AISEM Annual Conference

المؤلفون: Barbato, M., Cester, A., Mulloni, V., Margesin, B., De Pasquale, G., Soma, A., Meneghesso, G.

المصدر: 2014 44th European Solid State Device Research Conference (ESSDERC) Solid State Device Research Conference (ESSDERC), 2014 44th European. :70-73 Sep, 2014

Relation: ESSDERC 2014 - 44th European Solid State Device Research Conference

المؤلفون: Barbato, M., Cester, A., Mulloni, V., Margesin, B., Meneghesso, G.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 63(3):1274-1280 Mar, 2016

المؤلفون: Lucibello, A., Capoccia, G., Proietti, E., Marcelli, R., Margesin, B., Mulloni, V., Giacomozzi, F., Vitulli, F., Scipioni, M., Bartolucci, G.

المصدر: 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on. :1-5 Apr, 2014

Relation: 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Lucibello, A., Marcelli, R., Proietti, E., Bartolucci, G., Mulloni, V., Margesin, B.

المصدر: 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on. :1-6 Apr, 2013

Relation: 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Giacomozzi, F., Mulloni, V., Colpo, S., Iannacci, J., Margesin, B., Faes, A.

المصدر: CAS 2011 Proceedings (2011 International Semiconductor Conference) Semiconductor Conference (CAS), 2011 International. 1:155-158 Oct, 2011

Relation: 2011 International Semiconductor Conference (CAS 2011)

المؤلفون: Barbato, M., Mulloni, V., Barbato, A., Silvestrini, M., Cester, A., Meneghesso, G.

المصدر: 2017 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS),2017 IEEE International. :PA-1.1-PA-1.5 Apr, 2017

Relation: 2017 IEEE International Reliability Physics Symposium (IRPS)