يعرض 1 - 10 نتائج من 34 نتيجة بحث عن '"Multidrop bus"', وقت الاستعلام: 1.12s تنقيح النتائج
  1. 1
    دورية أكاديمية
    A 16-Gb/s 14.7-mW Tri-Band Cognitive Serial Link Transmitter With Forwarded Clock to Enable PAM-16/256-QAM and Channel Response Detection

    المؤلفون: Du, Y., Cho, W., Huang, P., Li, Y., Wong, C., Du, J., Kim, Y., Hu, B., Du, L., Liu, C., Lee, S.J., Chang, M.F.

    المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 52(4):1111-1122 Apr, 2017

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  2. 2
    دورية أكاديمية
    A Multidrop Bus Design Scheme With Resistor-Based Impedance Matching on Nonuniform Impedance Lines

    المؤلفون: Yoon, Y., Jeong, D.-K.

    المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 58(6):1264-1276 Jun, 2011

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  3. 3
    دورية أكاديمية
    A 2-Gb/s CMOS Integrating Two-Tap DFE Receiver for Four-Drop Single-Ended Signaling

    المؤلفون: Bae, S.-J., Chi, H.-J., Sohn, Y.-S., Lee, J.-S., Sim, J.-Y., Park, H.-J.

    المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 56(8):1645-1656 Aug, 2009

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  4. 4
    دورية أكاديمية
    Improvement Potential and Equalization Example for Multidrop DRAM Memory Buses

    المؤلفون: Fredriksson, H., Svensson, C.

    المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 32(3):675-682 Aug, 2009

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  5. 5
    دورية أكاديمية
    A Digital Spectrum Shaping Signaling Serial-Data Transceiver With Crosstalk and ISI Reduction Property in Multidrop Interfaces

    المؤلفون: Kim, G., Gharibdoust, K., Tajalli, A., Leblebici, Y.

    المصدر: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 63(12):1126-1130 Dec, 2016

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  6. 6
    Wireless Interconnect in Electronic Systems

    المؤلفون: Atsutake Kosuge, Tadahiro Kuroda

    المصدر: VLSI Design and Test for Systems Dependability ISBN: 9784431565925

    مصطلحات موضوعية: Interconnection, Multidrop bus, Computer science, Transmission line, Capacitive sensing, Electronic engineering, Object-relational impedance mismatch, Baseband, Signal integrity, Microstrip

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::06587ab7029d662ee6031ef8db710c57
    https://doi.org/10.1007/978-4-431-56594-9_21

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  7. 7
    A Multidrop Bus Design Scheme With Resistor-Based Impedance Matching on Nonuniform Impedance Lines

    المؤلفون: Yohwan Yoon, Deog-Kyoon Jeong

    المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers. 58:1264-1276

    مصطلحات موضوعية: Image impedance, Engineering, Multidrop bus, Transmission line, business.industry, Electronic engineering, Impedance matching, Damping factor, Impedance bridging, Output impedance, Electrical and Electronic Engineering, business, Characteristic impedance

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ee6614d258ee0e78b29f7fdb495e3d3f
    https://doi.org/10.1109/tcsi.2010.2092152

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  8. 8
    Improvement Potential and Equalization Example for Multidrop DRAM Memory Buses

    المؤلفون: Christer Svensson, Henrik Fredriksson

    المصدر: IEEE Transactions on Advanced Packaging. 32:675-682

    مصطلحات موضوعية: Dynamic random-access memory, Engineering, Hardware_MEMORYSTRUCTURES, business.industry, Equalization (audio), Memory bus, law.invention, Channel capacity, Multidrop bus, law, Electronic engineering, Electrical and Electronic Engineering, Latency (engineering), business, Dram, Communication channel

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1952806d041616bd547057ce0ff37e68
    https://doi.org/10.1109/tadvp.2009.2013818

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  9. 9
    A 2-Gb/s CMOS Integrating Two-Tap DFE Receiver for Four-Drop Single-Ended Signaling

    المؤلفون: Seung-Jun Bae, Hyung-Joon Chi, Jae-Seung Lee, Hong-June Park, Young-Soo Sohn, Jae-Yoon Sim

    المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers. 56:1645-1656

    مصطلحات موضوعية: Engineering, business.industry, Chip, Intersymbol interference, CMOS, Multidrop bus, Single-ended signaling, Integrator, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Electrical and Electronic Engineering, Stub Series Terminated Logic, business, Dram

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8f0da5c8b667b17fdaa994500e85aaa8
    https://doi.org/10.1109/tcsi.2008.2010099

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  10. 10
    A High-Speed Optical Multidrop Bus for Computer Interconnections

    المؤلفون: Moray McLaren, Sagi Mathai, Terrel L. Morris, Shih-Yuan Wang, Joseph Straznicky, Jong-Souk Yeo, Paul Kessler Rosenberg, M. Tan, Huei Pei Kuo, Norman P. Jouppi

    المصدر: IEEE Micro. 29:62-73

    مصطلحات موضوعية: Optical fiber, business.industry, Computer science, Electrical engineering, Waveguide (optics), law.invention, Multidrop bus, Hardware and Architecture, law, Embedded system, Bandwidth (computing), Bus, Local bus, Electronics, Signal integrity, Electrical and Electronic Engineering, business, Software, System bus

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ce3c6f6faa445ce6f92bcf7f3269ef3f
    https://doi.org/10.1109/mm.2009.57

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