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1
المؤلفون: Eckart Klusmann, Mustafa Ozkok, Sven Lamprecht, Henning Hubner
المصدر: 2019 IEEE CPMT Symposium Japan (ICSJ).
مصطلحات موضوعية: Materials science, Coating, EMI, Plating, Electromagnetic shielding, Electronic packaging, engineering, Mechanical engineering, Signal integrity, engineering.material, Electroplating, Electromagnetic interference
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c16d5ef22fe23159d1dfd6541c8ce633
https://doi.org/10.1109/icsj47124.2019.8998721 -
2
المؤلفون: Toshiya Fujiwara, Angelo Ferro, Mustafa Ozkok, Henning Huebner
المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
مصطلحات موضوعية: Substrate (building), Reliability (semiconductor), Materials science, chemistry, Plating, Copper plating, chemistry.chemical_element, Process variable, Electrolyte, Composite material, Current density, Copper
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::062fa910649164ae895ea409148c3178
https://doi.org/10.1109/eptc.2018.8654444 -
3
المؤلفون: Henning Hubner, Christian Ohde, Simon Chien, Mustafa Ozkok, Akif Özkök, Sven Lamprecht
المصدر: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
مصطلحات موضوعية: Engineering, business.industry, Plating, Copper plating, Electronics, Current (fluid), business, Engineering physics
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ebeb6ec838d6e8208ce0a2e08977eb3b
https://doi.org/10.1109/impact.2018.8625794 -
4
المؤلفون: Mustafa Ozkok, Jerome Bender, Hubertus Mertens
المصدر: International Symposium on Microelectronics. 2013:000663-000666
مصطلحات موضوعية: Lead frame, Planar, Materials science, chemistry, Soldering, Automotive Engineering, Metallurgy, chemistry.chemical_element, Quad Flat No-leads package, Composite material, Tin
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::50432e14ea98ded73345fd43a634277f
https://doi.org/10.4071/isom-2013-wp25 -
5
المؤلفون: Mustafa Ozkok, Sven Lamprecht, Arnd Kilian, Gustavo Ramos
المصدر: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001145-001184
مصطلحات موضوعية: Nickel, Materials science, chemistry, Metallurgy, Base (geometry), chemistry.chemical_element, Pharmacology (medical), Surface finish, Fine line, Chip, Layer (electronics), Copper, Palladium
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4911ddf97cf3ace1d301ae898166f611
https://doi.org/10.4071/2013dpc-wa24 -
6
المؤلفون: Mustafa Ozkok, Jerome Bender, Maren Bruder, Hubertus Mertens
المصدر: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
مصطلحات موضوعية: Lead frame, Materials science, chemistry, Soldering, Metallurgy, Immersion (virtual reality), chemistry.chemical_element, Quad Flat No-leads package, Integrated circuit packaging, Edge (geometry), Tin
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::334e984e4491f98378cbbd8a810e8af2
https://doi.org/10.1109/eptc.2013.6745805 -
7
المؤلفون: Mustafa Ozkok
المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
مصطلحات موضوعية: Lead bonding, Materials science, chemistry, Soldering, Metallurgy, Copper wire, chemistry.chemical_element, Deposition (phase transition), Surface finish, Copper, Surface finishing, Palladium
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ace87c50f08b50c4fe734f35da96335a
https://doi.org/10.1109/impact.2012.6420234 -
8
المؤلفون: Horst Clauberg, Mustafa Ozkok, Bill Kao
المصدر: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
مصطلحات موضوعية: Wire bonding, Materials science, chemistry, Plating, Metallurgy, Electronic packaging, chemistry.chemical_element, Substrate (printing), Surface finish, Layer (electronics), Copper, Surface finishing
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ef37d0648c60a442c7052442d876620c
https://doi.org/10.1109/impact.2011.6117179