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المؤلفون: R. Ranica, R. Berthelon, A. Gandolfo, G. Samanni, E. Gomiero, J. Jasse, P. Mattavelli, J. Sandrini, M. Querre, Y. Le-Friec, J. Poulet, V. Caubet, L. Favennec, C. Boccaccio, G. Ghezzi, C. Gallon, JC. Grenier, B. Dumont, O. Weber, A. Villaret, R. Beneyton, N. Cherault, D. Ristoiu, S. Del Medico, O. Kermarrec, JP. Reynard, P. Boivin, A. Souhaite, L. Desvoivres, S. Chouteau, PO. Sassoulas, L. Clement, A. Valery, E. Petroni, D. Turgis, A. Lippiello, L. Scotti, F. Disegni, A. Ventre, D. Ornaghi, M. De Tomasi, A. Maurelli, A. Conte, F. Arnaud, A. Redaelli, R. Annunziata, P. Cappelletti, F. Piazza, P. Ferreira, R. Gonella, E. Ciantar
المصدر: 2021 IEEE International Electron Devices Meeting (IEDM).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::652fcb15ec770ffda0355c498b7b0e9e
https://doi.org/10.1109/iedm19574.2021.9720669 -
2High Density Embedded PCM Cell in 28nm FDSOI Technology for Automotive Micro-Controller Applications
المؤلفون: Roberto Annunziata, L. Favennec, F. Disegni, D. Turgis, Jean-Luc Ogier, Remi Beneyton, Xavier Federspiel, N. Cherault, Fausto Piazza, A. Gandolfo, M. Molgg, E. Ciantar, Enrico Gomiero, P.O. Sassoulas, J. P. Reynard, B. Dumont, S. Delmedico, Alexandre Villaret, Olivier Weber, A. Viscuso, Franck Arnaud, L. Clement, L. Desvoivres, Paulo Ferreira, Paolo Mattavelli, C. Gallon, R. Ranica, O. Kermarrec, J. Jasse, S. Chouteau, C. Jahan, C. Boccaccio, Paolo Cappelletti, A. Souhaite, G. Samanni, Paola Zuliani, R. Berthelon, V. Caubet, Philippe Boivin, D. Ristoiu, Alfonso Maurelli, J. C. Grenier
المصدر: 2020 IEEE International Electron Devices Meeting (IEDM).
مصطلحات موضوعية: Computer science, business.industry, Reading (computer), Transistor, Bipolar junction transistor, Automotive industry, High density, law.invention, Microcontroller, Reliability (semiconductor), law, Soldering, Electronic engineering, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cb9d7d45a06fe3730a77e9eea337f87a
https://doi.org/10.1109/iedm13553.2020.9371934 -
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المؤلفون: Olivier Gourhant, Pascal Masson, Franck Julien, Jerome Goy, Giada Ghezzi, Jean-Luc Ogier, Thibault Kempf, Dann Morillon, Clement Pribat, Alexandre Villaret, N. Cherault, Stephan Niel, Philippe Lorenzini
المصدر: 2018 International Integrated Reliability Workshop (IIRW).
مصطلحات موضوعية: 010302 applied physics, Materials science, Dielectric strength, business.industry, 020208 electrical & electronic engineering, Oxide, 02 engineering and technology, Trapping, 01 natural sciences, Capacitance, Stress (mechanics), chemistry.chemical_compound, Reliability (semiconductor), chemistry, Logic gate, Electric field, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::28a688c95ccd71cf239092391ae754d5
https://doi.org/10.1109/iirw.2018.8727082 -
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المؤلفون: Q. Hubert, M. Mantelli, Y. Escarabajal, B. Duclaux, S. Audran, V. Arnal, Francois Maugain, Frederique Trenteseaux, E. Lepape, Abderrezak Marzaki, F. Baudin, Julien Delalleau, A. Champenois, D. Galpin, E. Beche, L. Baron, L. Parmigiani, Giada Ghezzi, Pascal Gouraud, F. La Rosa, Stephan Niel, Arnaud Regnier, B. Saidi, N. Cherault, T. Cabout
المصدر: 2018 IEEE International Electron Devices Meeting (IEDM)
مصطلحات موضوعية: 010302 applied physics, Class (computer programming), business.industry, Computer science, 020208 electrical & electronic engineering, Process (computing), 02 engineering and technology, 01 natural sciences, Term (time), Microcontroller, Memory cell, Embedded system, 0103 physical sciences, Trench, Process integration, 0202 electrical engineering, electronic engineering, information engineering, Architecture, business
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المؤلفون: Alexandre Villaret, Thibault Kempf, Dann Morillon, Jean-Luc Ogier, Giada Ghezzi, N. Cherault, Julien Delalleau, Franck Julien, Pascal Masson, Jerome Goy, Clement Pribat, Olivier Gourhant, Jean-Christophe Grenier, Stephan Niel
المصدر: 2017 IEEE International Integrated Reliability Workshop (IIRW).
مصطلحات موضوعية: 010302 applied physics, Materials science, Dielectric strength, High voltage transistors, Annealing (metallurgy), business.industry, Transistor, Oxide, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, law.invention, chemistry.chemical_compound, chemistry, law, Gate oxide, Logic gate, 0103 physical sciences, Optoelectronics, 0210 nano-technology, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::778ada43580ff7d4a24aaf81c3b444df
https://doi.org/10.1109/iirw.2017.8361239 -
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المؤلفون: Arnaud Tournier, L. Pinzelli, Francois Roy, D. Jeanjean, S. Hulot, F. Blanchet, Laurent Favennec, Didier Herault, C. Perrot, Francois Leverd, J.-P. Carrere, Helene Wehbe-Alause, S. Ricq, N. Cherault, P. Boulenc, C. Augier, Maxime Gatefait
المصدر: physica status solidi c. 11:50-56
مصطلحات موضوعية: Materials science, CMOS, business.industry, Optoelectronics, Image sensor, Condensed Matter Physics, business
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المؤلفون: Gilles. Micolau, Nicolas Breil, Pierre Morin, Damien Deleruyelle, N. Cherault, Mickael Gros-Jean, Christophe Muller, Alexandre Guiraud
المصدر: MRS Proceedings. 1252
مصطلحات موضوعية: Flash (photography), Materials science, X-ray photoelectron spectroscopy, Stack (abstract data type), business.industry, Interface (computing), Thermal, Optoelectronics, Electrical measurements, Dielectric, business, Layer (electronics)
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المؤلفون: T. Salvetat, Thomas Skotnicki, F. Abbate, J. Bienacel, Sébastien Barnola, Claire Fenouillet-Beranger, Philippe Garnier, N. Cherault, P. Perreau, Pascal Gouraud, Mickael Gros-Jean, D. Chanemougame, O. Faynot, Franck Arnaud, D. Barge, Remi Beneyton, M. Gattefait, Magali Gregoire, Simon Deleonibus, Stephane Denorme, Francois Leverd, Roland Pantel, P. Gros, P. Rivallin, Jean-Damien Chapon, B. Le-Gratiet, Cecilia M. Mezzomo, C. Leyris, N. Kubler, M. Marin, S. Kohler, C. Buj, G. Guierleo, Nicolas Loubet, X. Garros, M. Fournier, C. Laviron, E. Deloffre, Francois Andrieu, A. Torres, M. Casse
المصدر: Extended Abstracts of the 2008 International Conference on Solid State Devices and Materials.
مصطلحات موضوعية: Materials science, business.industry, Gate stack, Optoelectronics, business, Ground plane
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f2553d091959fe0943b2fd893fdf1c8d
https://doi.org/10.7567/ssdm.2008.b-9-4 -
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المؤلفون: F. Larman, D. Dormans, E. van der Vegt, M. Charleux, D. Boter, R. Pantel, M. Hopstaken, M. Bocat, J.-P. Carrere, N. Auriac, N. Cherault, K. Rochereau
المصدر: ESSDERC 2007 - 37th European Solid State Device Research Conference.
مصطلحات موضوعية: Materials science, business.industry, Doping, Hardware_PERFORMANCEANDRELIABILITY, Grain size, Flash memory, Flash (photography), CMOS, Thermal, Charge trap flash, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Optoelectronics, business, AND gate, Hardware_LOGICDESIGN
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5b8b4449a2274251328cb48d732ac14c
https://doi.org/10.1109/essderc.2007.4430928 -
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المؤلفون: N. Cherault, Marc Verdier, Olivier Thomas, Patrice Gergaud, Giovanni Carlotti, N. Casanova, C. Goldberg
المساهمون: Centre des Matériaux (MAT), MINES ParisTech - École nationale supérieure des mines de Paris, Université Paris sciences et lettres (PSL)-Université Paris sciences et lettres (PSL)-Centre National de la Recherche Scientifique (CNRS), STMicroelectronics [Crolles] (ST-CROLLES), Laboratoire de thermodynamique, propriétés électriques, contraintes, structures aux échelles nanométriques (TECSEN), Université Paul Cézanne - Aix-Marseille 3-Centre National de la Recherche Scientifique (CNRS), Laboratoire de thermodynamique et physico-chimie métallurgiques (LTPCM), Centre National de la Recherche Scientifique (CNRS)-Institut National Polytechnique de Grenoble (INPG)
المصدر: Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2005, 82, pp.368-373. ⟨10.1016/j.mee.2005.07.018⟩مصطلحات موضوعية: Materials science, Low-k dielectric, Mechanical properties, Young's modulus, 02 engineering and technology, Temperature cycling, Dielectric, Substrate (electronics), 01 natural sciences, chemistry.chemical_compound, symbols.namesake, Optics, Coefficient of thermal expansion, Plasma-enhanced chemical vapor deposition, 0103 physical sciences, Silicon carbide, Electrical and Electronic Engineering, Composite material, Silicon oxide, 010302 applied physics, business.industry, Poisson's ratio, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, chemistry, [PHYS.COND.CM-MS]Physics [physics]/Condensed Matter [cond-mat]/Materials Science [cond-mat.mtrl-sci], symbols, 0210 nano-technology, business, Elastic modulus