المؤلفون: x. BOIVIN, S. BENSOUSSAN, N. L’HOTELLIER, L. BIGNON, H. BRIVES, A. BRULE, J. GODET, M.L. GRANNEC, M. HAUSBERGER, F. KLING-EVEILLARD, C. TALLET, V. COURBOULAY

المصدر: INRAE Productions Animales, Vol 25, Iss 2 (2012)

مصطلحات موضوعية: Animal culture, SF1-1100, Aquaculture. Fisheries. Angling, SH1-691

وصف الملف: electronic resource

Relation: https://productions-animales.org/article/view/3205; https://doaj.org/toc/2824-3633

URL الوصول: https://doaj.org/article/33a384f180924aa4844384a8f7b08dd2

المؤلفون: S. Lhostis, A. Farcy, E. Deloffre, F. Lorut, S. Mermoz, Y. Henrion, L. Berthier, F. Bailly, D. Scevola, F. Guyader, F. Gigon, C. Besset, S. Pellissier, L. Gay, N. Hotellier, A. -L. Le Berrigo, S. Moreau, V. Balan, F. Fournel, A. Jouve, S. Cheramy, M. Arnoux, B. Rebhan, G. A. Maier, L. Chitu

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Wire bonding, Interconnection, Materials science, Copper interconnect, 02 engineering and technology, Direct bonding, 021001 nanoscience & nanotechnology, 01 natural sciences, Die (integrated circuit), CMOS, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Wafer, Image sensor, 0210 nano-technology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e802e06becc6637eabb0931ccd7563e4
https://doi.org/10.1109/ectc.2016.202

المؤلفون: P. Chausse, C. Brunet-Manquat, Christophe Aumont, A. Jouve, P. Coudrain, Severine Cheramy, Roselyne Segaud, J. P. Colonna, N. Sillon, N. Hotellier, G. Garnier, C. Laviron

المصدر: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000377-000397

مصطلحات موضوعية: Engineering drawing, Engineering, business.product_category, business.industry, Interface (computing), Electrical engineering, Chart, Power consumption, Face (geometry), Die (manufacturing), Pharmacology (medical), Point (geometry), Wafer, business, Backflow

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4f08b82af02026201407ce1c6fa28b26
https://doi.org/10.4071/2012dpc-ta13

المؤلفون: Claire Fenouillet-Beranger, E. Saugier, Vincent Fiori, E. Deloffre, A. Jouve, Alexis Farcy, Francois Guyader, N. Hotellier, Laurent Brunet, Severine Cheramy, Pascal Vivet, Perrine Batude, F. Breuf, F. Ponthenier, Sandrine Lhostis, R. Prieto, Jean-Philippe Colonna, Maud Vinet, Yann Henrion, Perceval Coudrain, Yannick Sanchez, L. Benaissa, R. Velard, Fabrice Casset, Jean Michailos, B. Vianne, L.-M. Collin

المصدر: 2015 IEEE International Electron Devices Meeting (IEDM).

مصطلحات موضوعية: Microelectromechanical systems, business.industry, Computer science, New product development, Hardware_INTEGRATEDCIRCUITS, Interposer, Systems engineering, Key (cryptography), Low density, Electronic engineering, Photonics, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fe649aefb83879dc2cbb1ccdf91a205e
https://doi.org/10.1109/iedm.2015.7409655

المؤلفون: Dorleta Cortaberria Sanz, Gilles Metellus, Francois Guyader, Dave Thomas, Yiping Song, Keith Buchanan, Alain Inard, Tony Wilby, Jean Michailos, N. Hotellier

المصدر: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2010:000539-000556

مصطلحات موضوعية: Engineering, Silicon, Image quality, business.industry, chemistry.chemical_element, CMOS, chemistry, Etching (microfabrication), Process integration, Electronic engineering, Pharmacology (medical), Wafer, Image sensor, business, Camera module

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d543386ea055fdb7c416f626d8876f09
https://doi.org/10.4071/2010dpc-ta14

المؤلفون: Vincent Fiori, Sebastien Gallois-Garreignot, Olivier Thomas, Pierre Bar, B. Vianne, P. Chausse, S. Escoubas, Komi Atchou Ewuame, N. Hotellier

المساهمون: Institut des Matériaux, de Microélectronique et des Nanosciences de Provence (IM2NP), Aix Marseille Université (AMU)-Université de Toulon (UTLN)-Centre National de la Recherche Scientifique (CNRS), STMicroelectronics [Crolles] (ST-CROLLES), STMicroelectronics, Université de Toulon (UTLN)-Centre National de la Recherche Scientifique (CNRS)-Aix Marseille Université (AMU)

المصدر: Microelectronics Reliability
Microelectronics Reliability, 2015, 55 (5), pp.738-746. ⟨10.1016/j.microrel.2015.02.005⟩
Microelectronics Reliability, Elsevier, 2015, 55 (5), pp.738-746. ⟨10.1016/j.microrel.2015.02.005⟩

مصطلحات موضوعية: Engineering, Mechanical engineering, 02 engineering and technology, Bending, 01 natural sciences, law.invention, [SPI.MAT]Engineering Sciences [physics]/Materials, Stress (mechanics), law, 0103 physical sciences, Electrical measurements, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Strain gauge, ComputingMilieux_MISCELLANEOUS, 010302 applied physics, Cauchy stress tensor, business.industry, Structural engineering, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Finite element method, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Interposer, Resistor, 0210 nano-technology, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::be2764f9cbd9779635f8d9f7784ce372
https://hal.science/hal-02114621

المؤلفون: F. de Crecy, Papa Momar Souare, J. Pruvost, Clement Tavernier, Perceval Coudrain, S. Dumas, Bastien Giraud, Alexis Farcy, H. Ben-Jamaa, Jean Michailos, N. Hotellier, L. Le Pailleur, András Borbély, C. Chancel, J.-M. Riviere, R. Franiatte, Sebastien Gallois-Garreignot, Vincent Fiori, C. Laviron, Jean-Philippe Colonna, Severine Cheramy

المصدر: 2014 IEEE International Electron Devices Meeting.

مصطلحات موضوعية: Interconnection, Through-silicon via, Computer science, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit, Chip, Finite element method, law.invention, Thermal optimization, Thermal mapping, law, Thermal, Hardware_INTEGRATEDCIRCUITS, Electronic engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::97a14ba8c0911fe1c139fec8cca2e7cc
https://doi.org/10.1109/iedm.2014.7047175

المؤلفون: E. Serret, F. Kovacs, C. Richard, M.M. Frank, N. Hotellier, L. Dumas, A. Beverina, Pascal Besson, Lucile Broussous, T. Billon

المصدر: Solid State Phenomena. :361-364

مصطلحات موضوعية: Materials science, Metallurgy, chemistry.chemical_element, Condensed Matter Physics, Isotropic etching, Copper, Atomic and Molecular Physics, and Optics, chemistry, Etching (microfabrication), Copper plating, General Materials Science, Wafer, Dry etching, Reactive-ion etching, Tin

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6993f8551fae56c857d3b5bb176d81bb
https://doi.org/10.4028/www.scientific.net/ssp.103-104.361

المؤلفون: Fiqiri Hodaj, N. Hotellier, Julien Bertheau, Jean Charbonnier

المساهمون: STMicroelectronics [Crolles] (ST-CROLLES), Science et Ingénierie des Matériaux et Procédés (SIMaP), Université Joseph Fourier - Grenoble 1 (UJF)-Centre National de la Recherche Scientifique (CNRS)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut de Chimie du CNRS (INC)-Institut National Polytechnique de Grenoble (INPG)

المصدر: Intermetallics
Intermetallics, Elsevier, 2014, 51, pp.37-47. ⟨10.1016/j.intermet.2014.02.012⟩

مصطلحات موضوعية: Shearing (physics), Materials science, Kirkendall effect, Mechanical Engineering, Shear force, Alloy, Metallurgy, Metals and Alloys, Intermetallic, General Chemistry, [CHIM.MATE]Chemical Sciences/Material chemistry, engineering.material, Shear (sheet metal), Mechanics of Materials, Materials Chemistry, engineering, Shear strength, Direct shear test, Composite material, ComputingMilieux_MISCELLANEOUS

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8acd0e50ad159b34dd29eef3abee25bd
https://hal.archives-ouvertes.fr/hal-01138844

المؤلفون: D. Le Cunff, N. Hotellier, S. Eynard, J. P. Piel, P. Bar, G. Fresquet, K. Le Chao, M. Tardif, L. L. Chapelon

المصدر: 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).

مصطلحات موضوعية: Data set, Consistency (database systems), Engineering, Cross-correlation, business.industry, Process integration, Key (cryptography), Process (computing), Electronic engineering, business, Signature (logic), Advanced process control

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::08743f1d0b4dd92b9e9374b50d86b705
https://doi.org/10.1109/asmc.2014.6846978