المؤلفون: Nai, S.M.L., Han, Y.D., Jing, H.Y., Xu, L.Y., Tan, C.M., Wei, J.

المصدر: 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :437-440 Dec, 2010

Relation: 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

المؤلفون: Nai, S.M.L., Wei, J., Lim, P.C., Wong, C.K.

المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :119-124 2003

Relation: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)

المؤلفون: Wang, H., Zhu, Z.G., Chen, H., Wang, A.G., Liu, J.Q., Liu, H.W., Zheng, R.K., Nai, S.M.L., Primig, S., Babu, S.S., Ringer, S.P., Liao, X.Z.

المصدر: In Acta Materialia 1 September 2020 196:609-625

المؤلفون: Lu, S.L., Meenashisundaram, G.K., Wang, P., Nai, S.M.L. ^*, Wei, J. ^*

المصدر: In Additive Manufacturing August 2020 34

المؤلفون: Jun Wei, Nai, S.M.L., Wong, C.K.S., Zheng Sun, Loke Chong Lee

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 26(3):289-294 Aug, 2003

المؤلفون: Han, Y.D., Jing, H.Y., Nai, S.M.L., Xu, L.Y., Tan, C.M., Wei, J.

المصدر: 2010 3rd International Nanoelectronics Conference (INEC) Nanoelectronics Conference (INEC), 2010 3rd International. :219-221 Jan, 2010

Relation: 2010 IEEE 3rd International Nanoelectronics Conference (INEC)

المؤلفون: Han, Y.D., Jing, H.Y., Nai, S.M.L., Xu, L.Y., Tan, C.M., Wei, J.

المصدر: 2009 11th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. :292-295 Dec, 2009

Relation: 2009 11th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Nguyen, Q.B., Zhu, Z., Ng, F.L., Chua, B.W., Nai, S.M.L., Wei, J.

المصدر: In Journal of Materials Science & Technology February 2019 35(2):388-394

المؤلفون: Chew, Y., Bi, G.J., Zhu, Z.G., Ng, F.L., Weng, F., Liu, S.B., Nai, S.M.L., Lee, B.Y.

المصدر: In Materials Science & Engineering A 28 January 2019 744:137-144

المؤلفون: Han, Y.D., Jing, H.Y., Nai, S.M.L., Tan, C.M., Wei, J., Xu, L.Y., Zhang, S.R.

المصدر: 2008 10th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th. :689-695 Dec, 2008

Relation: 2008 10th Electronics Packaging Technology Conference (EPTC)