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1مؤتمر
المؤلفون: Muller, Hanna, Kartsch, Victor, Magno, Michele, Benini, Luca
المصدر: 2024 IEEE Sensors Applications Symposium (SAS) Sensors Applications Symposium (SAS), 2024 IEEE. :1-6 Jul, 2024
Relation: 2024 IEEE Sensors Applications Symposium (SAS)
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2مؤتمر
المؤلفون: Ning, Yulin, Qiu, Jiayong, Yu, Binhai, Li, Zongtao, Li, Jiasheng
المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024
Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)
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3مؤتمر
المؤلفون: Huang, Yuhua, Wang, Chengxin, Sun, Kailin, Mou, Yun, Wang, Shizhao
المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024
Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)
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4مؤتمر
المؤلفون: Liu, Fang, Zhu, Hui, Zhang, Yu, Li, Daohui, Wang, Youyang, Zhu, Xiaobo, Gu, Wenhua
المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024
Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)
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5مؤتمر
المؤلفون: Liu, Jiaxin, Shi, Laifeng, Yu, Xiaolong, Zhang, Shengxuan, Chen, Cai, Kang, Yong
المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024
Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)
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6مؤتمر
المؤلفون: Gao, Chenshan, Li, Shizhen, Yao, Qian, Li, Yuhong, Liu, Jiafeng, Tian, Tiancheng, Wang, Lingen, Wu, Shaohui, Ye, Huaiyu
المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024
Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)
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7مؤتمر
المؤلفون: Chen, Deyi, Tian, Ben, Wang, Xinyuan, Xu, Jianming, Guan, Quanxue, Mou, Yun
المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024
Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)
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8مؤتمر
المؤلفون: Samsuri, Muhammad Hafiz, Yuen, Shang Li, Lau, Phooi Yee, Wong, Chin Wee, Kamarudin, Nur Afiqah, Hussin, Zarina, Talib, Muhammad Syukri Mohd, Hon, Hock Woon
المصدر: 2024 IEEE 19th Conference on Industrial Electronics and Applications (ICIEA) Industrial Electronics and Applications (ICIEA), 2024 IEEE 19th Conference on. :1-6 Aug, 2024
Relation: 2024 IEEE 19th Conference on Industrial Electronics and Applications (ICIEA)
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9مؤتمر
المؤلفون: Hu, Xin-Rong, Tang, Min, Lu, Ming-Jian, Ouyang, Wu, Yan, Xin-Ping
المصدر: 2024 IEEE International Conference on Mechatronics and Automation (ICMA) Mechatronics and Automation (ICMA), 2024 IEEE International Conference on. :113-117 Aug, 2024
Relation: 2024 IEEE International Conference on Mechatronics and Automation (ICMA)
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10مؤتمر
المؤلفون: Mengozzi, Sebastiano, Zanatta, Luca, Barchi, Francesco, Bartolini, Andrea, Acquaviva, Andrea
المصدر: 2024 IEEE International Conference on Omni-layer Intelligent Systems (COINS) Omni-layer Intelligent Systems (COINS), 2024 IEEE International Conference on. :1-6 Jul, 2024
Relation: 2024 IEEE International Conference on Omni-layer Intelligent Systems (COINS)