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1
المؤلفون: Wataru Iwaya, Yosuke Sato, Misaki Sakamoto, Masanori Yamagishi, Naoya Saiki
المصدر: IMAPSource Proceedings. 2022
مصطلحات موضوعية: Automotive Engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::14d6db1f1a587786303af70e96133f36
https://doi.org/10.4071/001c.74636 -
2
المؤلفون: Yoshiki Furukawa, Manabu Miyawaki, Susumu Miura, Hironori Shizuhata, Naoya Saiki
المصدر: 2022 IEEE CPMT Symposium Japan (ICSJ).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5cf22d38a0dad20ff0b980b805e105fa
https://doi.org/10.1109/icsj55786.2022.10034704 -
3A Novel Dicing tape for WLCSP Using Stealth Dicing Through Dicing tape and Back Side Protection-Film
المؤلفون: Yoji Wakayama, Shigeyuki Yamashita, Kenta Furuno, Naoya Saiki, Shinya Takyu
المصدر: International Symposium on Microelectronics. 2019:000333-000337
مصطلحات موضوعية: Dicing tape, business.industry, Computer science, Chip-scale package, Chip size, Automotive Engineering, Electrical engineering, Wafer, Wafer dicing, business, Internet of Things
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c243488659da9f678bc616dc5b6daeec
https://doi.org/10.4071/2380-4505-2019.1.000333 -
4
المؤلفون: Yuichiro Komasu, Rikiya Kobashi, Daisuke Yamamoto, Naoya Saiki
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::900bc757e8081ccadad5b3588cf26cc4
https://doi.org/10.1109/eptc53413.2021.9663940 -
5
المؤلفون: Keisuke Shinomiya, Naoya Saiki, Yousuke Sato, Manabu Miyawaki, Tomotaka Morishita, Reina Kainuma
المصدر: 2021 IEEE CPMT Symposium Japan (ICSJ).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7881132d0a7af15422ca5d66c5a54643
https://doi.org/10.1109/icsj52620.2021.9648869 -
6
المؤلفون: Shinya Takyu, Yamamoto Daisuke, Naoya Saiki
المصدر: 2019 IEEE CPMT Symposium Japan (ICSJ).
مصطلحات موضوعية: Heat curing, Materials science, engineering.material, Chip, medicine.disease_cause, Coating, Mold, medicine, engineering, Wafer, Wafer dicing, Composite material, Layer (electronics), Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::239cb52b14d8153533d1dcf6114e1977
https://doi.org/10.1109/icsj47124.2019.8998642 -
7
المؤلفون: Shinya Takyu, Takafumi Ogasawara, Naoya Saiki
المصدر: 2018 IEEE CPMT Symposium Japan (ICSJ).
مصطلحات موضوعية: 0209 industrial biotechnology, Materials science, Base (geometry), 02 engineering and technology, Chip, Load cell, Dicing tape, 020303 mechanical engineering & transports, 020901 industrial engineering & automation, 0203 mechanical engineering, Pickup, Wafer dicing, Adhesive, Composite material, Position sensor
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::40dda12ec19c2a39560c08bee6f13ed0
https://doi.org/10.1109/icsj.2018.8602645 -
8
المؤلفون: Naoya Saiki, Hideki Takenaka, Morio Toyoshima, Eiji Okamoto
المصدر: International Conference on Space Optics — ICSO 2016.
مصطلحات موضوعية: Transmission (telecommunications), business.industry, Computer science, Frequency band, Electrical engineering, Communications satellite, Optical wireless, Optical communication, Physics::Optics, Wireless, Radio frequency, business, Free-space optical communication
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::929f413fe8aa2d1f2e60df22aae2737a
https://doi.org/10.1117/12.2296175 -
9
المؤلفون: Yuichiro Komasu, Kazuto Aizawa, Jun Maeda, Naoya Saiki
المصدر: ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
مصطلحات موضوعية: Materials science, genetic structures, business.industry, Pressure sensitive, C++ string handling, Optoelectronics, Wafer, sense organs, Adhesive, Composite material, business, Ultraviolet radiation, Finite element method
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8410906586568504a4aa36e7f0db0c54
https://doi.org/10.1115/ipack2017-74010 -
10
المؤلفون: Naoya Saiki, Shinya Takyu, Shigeyuki Yamashita
المصدر: 2016 IEEE CPMT Symposium Japan (ICSJ).
مصطلحات موضوعية: 010302 applied physics, Wire bonding, Engineering, Through-silicon via, business.industry, ComputingMilieux_PERSONALCOMPUTING, Power saving, Process (computing), Hardware_PERFORMANCEANDRELIABILITY, Chip, 01 natural sciences, Dicing tape, Embedded system, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Wafer, Wafer dicing, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b9c39aa5c87ec20238e2e62ac2d0bc1b
https://doi.org/10.1109/icsj.2016.7801301