يعرض 1 - 6 نتائج من 6 نتيجة بحث عن '"Nathapong, S."', وقت الاستعلام: 1.35s تنقيح النتائج
  1. 1
    مؤتمر
    A dynamic study of pad structure impact on bond pad/low-K layer stress in copper wire bond

    المؤلفون: Yang, Y B., Kumar, N., John, D., Hyman, R., Clive, F., Nathapong, S., Ramroth, William

    المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :654-658 Dec, 2012

    Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

    Full Text Finder
    أضف إلى المفضلة
  2. 2
    مؤتمر
    Design for reliability of Hi-density Leadless Array (HLA™) package

    المؤلفون: Yang, Y.B., Serafin, P., Zheng, B.Y., Nathapong, S., Edward, T., Surasit, C.

    المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :636-641 Dec, 2011

    Relation: 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

    Full Text Finder
    أضف إلى المفضلة
  3. 3
    مؤتمر
    Multi chip stacking & reliability challenges using TSV-micro C4 solder interconnection for FCCSP TSV package

    المؤلفون: Au, K.Y., Beleran, J.D., Yang, Y.B., Zhang, Y.F., Kriangsak, S.L., Wilson, P.L Ong, Drake, Y.S.Koh, Nathapong, S

    المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :608-619 Dec, 2011

    Relation: 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

    Full Text Finder
    أضف إلى المفضلة
  4. 4
    مؤتمر
    Reliability design for exposed pad and low-profile leadframe package

    المؤلفون: Yang, Y. B., Zhang, X. R., Zhu, W. H., Teddy, J. C., Liang, Y. W., Nathapong, S., Surasit, C.

    المصدر: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :643-647 Aug, 2010

    Relation: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

    Full Text Finder
    أضف إلى المفضلة
  5. 5
    مؤتمر
    3D interconnection process development and integration with low stress TSV

    المؤلفون: Chua, T. T., Ho, S. W., Li, H. Y., Khong, C. H., Liao, E. B, Chew, S. P., Lee, W. S., Lim, L. S., Pang, X. F., Kriangsak, S. L., Ng, C., Nathapong, S, Toh, C. H.

    المصدر: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :798-802 Jun, 2010

    Relation: 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    Full Text Finder
    أضف إلى المفضلة
  6. 6
    مؤتمر
    Temporary Bonding of Wafer to Carrier for 3D-Wafer Level Packaging.

    المؤلفون: Shuangwu, M.H., Pang, D., Nathapong, S., Marimuthu, P.

    المصدر: 2008 10th Electronics Packaging Technology Conference; 2008, p405-411, 7p

    Full Text Finder
    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء