المؤلفون: Chen, X.Y., Toh, K.C., Chai, J.C., Wong, T.N., Pinjala, D., Navas, O.K., Ganesh, Hengyun Zhang, Kripesh, V.

المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :633-637 2003

Relation: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)

المؤلفون: Zhang, H.Y., Pinjala, D., Navas, O.K., Iyer, M.K., Chan, P.K., Liu, X.P., Hayashi, H., Han, J.B.

المصدر: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on. :433-440 2002

Relation: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

المؤلفون: Chai, T.C., Xiaowu Zhang, Li, H.Y., Sekhar, V.N., Hnin, W.Y., Thew, M.L., Navas, O.K., Lau, John, Murthy, R., Balakumar, S., Tan, Y.M., Cheng, C.K., Liew, S.L., Chi, D.Z., Zhu, W.H.

المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :38-45 May, 2008

Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)

المؤلفون: Ranganathan, N., Ebin, Liao, Linn, Linn, Lee, Wen Sheng Vincent, Navas, O.K., Kripesh, V., Balasubramanian, N.

المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :859-865 May, 2008

Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)

المؤلفون: Chen, X.Y., Toh, K.C., Wong, T.N., Chai, J.C., Pinjala, D., Navas, O.K., Ganesh, Hengyun Zhang, Kripesh, V.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 1:199-206 Vol.1 2004

Relation: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.