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المؤلفون: Tze-Chiang Huang, Jungi Choi, Vivek Chickermane, Hayden Hyungdong Lee, Min-Jer Wang, Saman M. I. Adham, Sandeep Kumar Goel, Sangdoo Kim, Ashok B. Mehta, Subhasish Mukherjee, Ji-Jan Chen, Brion Keller, Jeongho Cho, Navdeep Sood, Thomas Valind, Frank Lee
المصدر: Handbook of 3D Integration
مصطلحات موضوعية: Engineering, Through-silicon via, business.industry, Semiconductor device fabrication, Three-dimensional integrated circuit, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit design, Test method, Chip, Embedded system, Hardware_INTEGRATEDCIRCUITS, Interposer, business, Dram
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4dad1af9a1545bf10c2a932e71fcc7fc
https://doi.org/10.1109/test.2013.6651893 -
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المؤلفون: Vivek Chickermane, Sergej Deutsch, Ji-Jan Chen, Erik Jan Marinissen, Brion Keller, Sandeep Kumar Goel, Subhasish Mukherjee, Frank Lee, Ashok B. Mehta, Navdeep Sood
المصدر: ITC
مصطلحات موضوعية: Interconnection, Engineering, Boundary scan, business.industry, Interface (computing), Embedded system, Design for testing, Automatic test pattern generation, business, Automation, Random access, Dram
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4a5dd902c98f9c517b335f7c76a2ff97
https://doi.org/10.1109/test.2012.6401569