يعرض 1 - 10 نتائج من 857 نتيجة بحث عن '"Nee, Hans‐Peter"', وقت الاستعلام: 0.82s تنقيح النتائج
  1. 1
    مؤتمر
    Comparative Analysis of Shunt-Based and SiC MOSFET Rds(on)-Based Autonomous Gate Drivers for TCM-Based ZVS Two-Level Three-Phase Inverters for EV Drive Systems

    المؤلفون: Abbas, Khizra, Nee, Hans-Peter

    المصدر: 2024 IEEE Transportation Electrification Conference and Expo (ITEC) Transportation Electrification Conference and Expo (ITEC), 2024 IEEE. :1-8 Jun, 2024

    Relation: 2024 IEEE Transportation Electrification Conference and Expo (ITEC)

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  2. 2
    مؤتمر
    Analysis and Optimization of LC Filter Components for TCM-based Zero Voltage Switching Two-Level Three-Phase Inverters for Electric Vehicle Drive Systems

    المؤلفون: Abbas, Khizra, Nee, Hans-Peter

    المصدر: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 2024 IEEE 10th International. :2064-2071 May, 2024

    Relation: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)

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  3. 3
    مؤتمر
    Comparison of Short-Term Over-current Capability of SiC Devices using Microchannel Cooling below and on top of the Chip

    المؤلفون: Bhadoria, Shubhangi, S, Soundhariya G, Nee, Hans-Peter

    المصدر: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 2024 IEEE 10th International. :356-362 May, 2024

    Relation: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)

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  4. 4
    مؤتمر
    Analysis of the Thermo-mechanical Performance of Double-Sided Cooled Power Modules

    المؤلفون: Singh, Bhanu Pratap, Ghahfarokhi, Shahriar Sarmast, Kostov, Konstantin, Nee, Hans-Peter, Norrga, Staffan

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-8 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  5. 5
    مؤتمر
    Comprehensive Insight into the Operational Dynamics of TCM-Based Zero-Voltage Switching (ZVS) Two-Level Three-Phase Inverters for Electric Vehicle (EV) Motor-Drive Applications

    المؤلفون: Abbas, Khizra, Nee, Hans-Peter, Kostov, Konstantin

    المصدر: 2024 IEEE Texas Power and Energy Conference (TPEC) IEEE Texas Power and Energy Conference (TPEC), 2024. :1-6 Feb, 2024

    Relation: 2024 IEEE Texas Power and Energy Conference (TPEC)

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  6. 6
    مؤتمر
    DC-Side Impedance Modeling and Stability Assessment in Grid-Forming Modular Multilevel Converters

    المؤلفون: Nahalparvari, Mehrdad, Asoodar, Mohsen, Norrga, Staffan, Nee, Hans-Peter

    المصدر: 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) Power Electronics and Applications (EPE'23 ECCE Europe), 2023 25th European Conference on. :1-9 Sep, 2023

    Relation: 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)

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  7. 7
    Comparison of Top and Bottom Cooling for Short Duration of Over-Currents for SiC Devices: An Analysis of the Quantity and Location of Heat-Absorbing Materials

    المؤلفون: Bhadoria, Shubhangi, Ganesan Soundararajan, Soundhariya, Nee, Hans-Peter, 1963

    المصدر: IEEE Open Journal of Power Electronics. 5:765-778

    مصطلحات موضوعية: Electrical Engineering, Elektro- och systemteknik

    وصف الملف: print

    URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-347073
    https://doi.org/10.1109/ojpel.2024.3407163

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  8. 8
    AC-Side Impedance-Based Stability Assessment in Grid-Forming Modular Multilevel Converters

    المؤلفون: Nahalparvari, Mehrdad, Asoodar, Mohsen, Norrga, Staffan, 1968, Nee, Hans-Peter, 1963

    المصدر: IEEE Access. 12:23514-23528

    مصطلحات موضوعية: Control interaction, frequency-domain analysis, grid-forming control, harmonic linearization, impedance modeling, modular multilevel converter (MMC), stability

    وصف الملف: print

    URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-343989
    https://doi.org/10.1109/ACCESS.2024.3365053

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  9. 9
    مؤتمر
    Over-current Capability of SiC Devices for Short Power and Heat Pulses

    المؤلفون: Bhadoria, Shubhangi, Nee, Hans-Peter

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-5 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  10. 10
    مؤتمر
    Analyzing the Impact of Die Positions inside the Power Module on the Reliability of Solder Layers for Different Power Cycling Scenarios

    المؤلفون: Singh, Bhanu Pratap, Li, Shirong, Choudhury, Khaled Redwan, Norrga, Staffan, Nee, Hans-Peter

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-9 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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