المؤلفون: Neyret, M., Fischer, M., Allan, E., Hölzel, N., Klaus, V.H., Kleinebecker, T., Krauss, J., Le Provost, G., Peter, S., Schenk, N., Simons, N.K., van der Plas, F., Binkenstein, J., Börschig, C., Jung, K., Prati, D., Schäfer, D., Schäfer, M., Schöning, I., Schrumpf, M., Tschapka, M., Westphal, C., Manning, P.

المصدر: In Ecosystem Services December 2021 52

المؤلفون: Charbonnier, J., Hida, R., Henry, D., Cheramy, S., Chausse, P., Neyret, M., Hajji, O., Garnier, G., Brunet-Manquat, C., Haumesser, P. H., Vandroux, L., Anciant, R., Sillon, N., Farcy, A., Rousseau, M., Cuzzocrea, J., Druais, G., Saugier, E.

المصدر: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :1077-1082 Jun, 2010

Relation: 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

المؤلفون: Henry, D., Cheramy, S., Charbonnier, J., Chausse, P., Neyret, M., Garnier, G., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Farcy, A., Cadix, L., Rousseau, M., Saugier, E.

المصدر: 2009 11th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. :528-535 Dec, 2009

Relation: 2009 11th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Henry, D., Cheramy, S., Charbonnier, J., Chausse, P., Neyret, M., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Gagnard, X., Saugier, E.

المصدر: 2009 IEEE International Conference on 3D System Integration 3D System Integration, 2009. 3DIC 2009. IEEE International Conference on. :1-7 Sep, 2009

Relation: 2009 IEEE International Conference on 3D System Integration (3DIC)

المؤلفون: Cheramy, S., Charbonnier, J., Henry, D., Astier, A., Chausse, P., Neyret, M., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Gagnard, X., Vittu, J.

المصدر: 2009 European Microelectronics and Packaging Conference Microelectronics and Packaging Conference, 2009. EMPC 2009. European. :1-6 Jun, 2009

Relation: 2009 European Microelectronics and Packaging Conference (EMPC)

المؤلفون: Henry, D., Jacquet, F., Neyret, M., Baillin, X., Enot, T., Lapras, V., Brunet-Manquat, C., Charbonnier, J., Aventurier, B., Sillon, N.

المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :556-562 May, 2008

Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)

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تسجيل الدخول للوصول الكامل.

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

المؤلفون: Neyret, M., De Rouw, Anneke, Colbach, N., Robain, Henri, Soulileuth, B., Valentin, Christian

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od_______932::b01a54de658c8101d5ce400a3f91457f
http://www.documentation.ird.fr/hor/fdi:010078834

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.