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1دورية أكاديمية
المصدر: IEEE Industry Applications Magazine IEEE Ind. Appl. Mag. Industry Applications Magazine, IEEE. 30(2):38-50 Apr, 2024
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2مؤتمر
المؤلفون: Huai, Y., Chen, Y., Almanee, S., Ngo, T., Liao, X., Wan, Z., Chen, Q.A., Garcia, J.
المصدر: 2023 IEEE/ACM 45th International Conference on Software Engineering (ICSE) ICSE Software Engineering (ICSE), 2023 IEEE/ACM 45th International Conference on. :2591-2603 May, 2023
Relation: 2023 IEEE/ACM 45th International Conference on Software Engineering (ICSE)
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3دورية أكاديمية
المؤلفون: Le, B.-N. T., L. Nguyen, A.Aff2, Aff3, Ngo, T. T.Aff3, Aff4, Duong, T.-L. H., Nguyen, T.-V. T., Nguyen, P.-A., Nguyen, H.-D. P., Pham, T.-P. T.Aff1, Aff5, IDs13762024054724_cor8
المصدر: International Journal of Environmental Science and Technology. 21(10):7307-7320
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4دورية أكاديمية
المؤلفون: Truong, T.-N.-S.Aff1, Aff2, Kieu-Le, T.-C.Aff2, Aff3, Ngo, T.-P.Aff2, Aff3, Strady, E.Aff1, Aff4, IDs13762024055436_cor4
المصدر: International Journal of Environmental Science and Technology. :1-18
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5دورية أكاديمية
المؤلفون: Ngo, T., Pathirana, P.N., Horne, M.K., Corben, L.A., Harding, I.H., Szmulewicz, D.J.
المصدر: IEEE Access Access, IEEE. 11:14006-14027 2023
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6دورية أكاديمية
المصدر: IEEE Transactions on Mobile Computing IEEE Trans. on Mobile Comput. Mobile Computing, IEEE Transactions on. 21(11):3807-3821 Nov, 2022
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7دورية أكاديمية
المؤلفون: Alexander, SPH, Christopoulos, A, Davenport, AP, Kelly, E, Mathie, A, Peters, JA, Veale, EL, Armstrong, JF, Faccenda, E, Harding, SD, Pawson, AJ, Southan, C, Davies, JA, Abbracchio, MP, Alexander, W, Al-hosaini, K, Back, M, Barnes, NM, Bathgate, R, Beaulieu, JM, Bernstein, KE, Bettler, B, Birdsall, NJM, Blaho, V, Boulay, F, Bousquet, C, Brauner-Osborne, H, Burnstock, G, Calo, G, Castano, JP, Catt, K, Ceruti, S, Chazot, P, Chiang, N, Chini, B, Chun, J, Cianciulli, A, Civelli, O, Clapp, LH, Couture, R, Csaba, Z, Dahlgren, C, Dent, G, Singh, KD, Douglas, SD, Dournaud, P, Eguchi, S, Escher, E, Filardo, EJ, Fong, T, Fumagalli, M, Gainetdinov, RR, de Gasparo, M, Gerard, C, Gershengorn, M, Gobeil, F, Goodfriend, TL, Goudet, C, Gregory, KJ, Gundlach, AL, Hamann, J, Hanson, J, Hauger, RL, Hay, DL, Heinemann, A, Hollenberg, MD, Holliday, ND, Horiuchi, M, Hoyer, D, Hunyady, L, Husain, A, IJzerman, AP, Inagami, T, Jacobson, KA, Jensen, RT, Jockers, R, Jonnalagadda, D, Karnik, S, Kaupmann, K, Kemp, J, Kennedy, C, Kihara, Y, Kitazawa, T, Kozielewicz, P, Kreienkamp, HJ, Kukkonen, JP, Langenhan, T, Leach, K, Lecca, D, Lee, JD, Leeman, SE, Leprince, J, Li, XX, Williams, TL, Lolait, SJ, Lupp, A, Macrae, R, Maguire, J, Mazella, J, McArdle, CA, Melmed, S, Michel, MC, Miller, LJ, Mitolo, V, Mouillac, B, Muller, CE, Murphy, P, Nahon, JL, Ngo, T, Norel, X, Nyimanu, D, Ocarroll, AM, Offermanns, S, Panaro, MA, Parmentier, M, Pertwee, RG, Pin, JP, Prossnitz, ER, Quinn, M, Ramachandran, R, Ray, M, Reinscheid, RK, Rondard, P, Rovati, GE, Ruzza, C, Sanger, GJ, Schoneberg, T, Schulte, G, Schulz, S, Segaloff, DL, Serhan, CN, Stoddart, LA, Sugimoto, Y, Summers, R, Tan, VP, Thal, D, Thomas, W, Timmermans, PMWM, Tirupula, K, Tulipano, G, Unal, H, Unger, T, Valant, C, Vanderheyden, P, Vaudry, D, Vaudry, H, Vilardaga, JP, Walker, CS, Wang, JM, Ward, DT, Wester, HJ, Willars, GB, Woodruff, TM, Yao, CC, Ye, RD
المصدر: British journal of pharmacology. 178(178 Suppl 1):S27-S156
مصطلحات موضوعية: Medicin och hälsovetenskap
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8دورية أكاديمية
المصدر: IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 32(10):1211-1214 Oct, 2022
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9دورية أكاديمية
المؤلفون: Ngo, T., Nguyen, D.C., Pathirana, P.N., Corben, L.A., Delatycki, M.B., Horne, M., Szmulewicz, D.J., Roberts, M.
المصدر: IEEE Transactions on Neural Systems and Rehabilitation Engineering IEEE Trans. Neural Syst. Rehabil. Eng. Neural Systems and Rehabilitation Engineering, IEEE Transactions on. 30:803-811 2022
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10دورية أكاديمية
المؤلفون: Ngo, T-D., Ton-That, M.-T., Hoa, S.V., Cole, K.C.
المصدر: Science and Engineering of Composite Materials, Vol 17, Iss 1, Pp 19-30 (2010)
مصطلحات موضوعية: Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource