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1مؤتمر
المؤلفون: Ramanathan, Eswar, Katragadda, Veenadhar, Gasasira, Arthur, Muthee, Martin, Riendeau, Jeffrey, Hatzistergos, Michael, Mody, Jay, Teo, Kok Hin, Clements, Justin, Qiu, Jian, Wang, Qiushi, Nicolai, Petrov, Liao, Vincent, Hwang, Jung Tae, Krom, Raymond, Venkatasubramanian, Vandana, Bombardier, Colin, Ahmed, Shafaat, Montgomery, Christa, Brown, Owen, Smith, Lloyd, Cusick, Alan, Soler, Edwin, Evans, Bill
المصدر: 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2019 30th Annual SEMI. :1-4 May, 2019
Relation: 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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2
المؤلفون: Han Wah Ng, Shao Beng Law, Nicolai Petrov, Shinichiro Kakita, San Leong Liew, Jonathan Rullan, Seungman Choi
المصدر: 2018 IEEE International Interconnect Technology Conference (IITC).
مصطلحات موضوعية: Materials science, business.industry, Physical vapor deposition, Plating, Chemical-mechanical planarization, Copper interconnect, Optoelectronics, Dielectric substrate, Dielectric, business, Electrochemistry, Line (electrical engineering)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3d8dd3a7c54c8ad243e25e585c2065d1
https://doi.org/10.1109/iitc.2018.8430484 -
3
المؤلفون: Pietro Babighian, Muhammed Pallachali, Nicolai Petrov, Tamer Desouky, Teck Jung Tang, Fadi Batarseh, Deborah Ryan, Shweta Shokale, Mark Terry, Haizhou Yin, Rohan Deshpande, Jiechang Hou, Yixiao Zhang, Sang-Kee Eah, Rao Desineni, Feng Wang, Ahmed Khalil
المصدر: Photomask Technology.
مصطلحات موضوعية: Engineering, Engineering drawing, Yield (engineering), Silicon, business.industry, chemistry.chemical_element, Edge (geometry), chemistry, Electronic engineering, Process control, Process window, Upstream (networking), Wafer, business, Aerial image
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::379ffba485daca644e6c71206a0b34f3
https://doi.org/10.1117/12.2280568 -
4
المؤلفون: Kunal Shrotri, Jin Lu, Jim Hofmann, Thy Tran, Phillip J. Ireland, Allen McTeer, Vasil Antonov, Dale W. Collins, Nicolai Petrov, Hongqian Sun, Greg Herdt, Joseph T. Lindgren, Pratap Murali, T. Owens, Stefano Guerrieri, Rita J. Klein, Siddartha Kondoju, Shane Trapp, Yushi Hu, Kevin Titus
المصدر: ECS Transactions. 50:53-72
مصطلحات موضوعية: Physics, chemistry, chemistry.chemical_element, Line (text file), Scaling, Copper, Computational physics
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5دورية أكاديمية
المؤلفون: Nicolai Petrov, Nicolai Atanasov, Uliana Paskaleva
المصدر: Faculty of Economics, SOUTH-WEST UNIVERSITY 'NEOFIT RILSKI', BLAGOEVGRAD, Economics and Management. 4(1):12-16
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6
المؤلفون: Daniel Stritch, Jeff Barnes, Elizabeth Walker, Charles Valverde, Vincent Paneccasio, Christian Witt, Chen Xu, Qingyun Chen, Nicolai Petrov, Eugene Shalyt, Michael Pavlov
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Line resistance, Nanolithography, Materials science, Thin layers, Chemical engineering, chemistry, Phase composition, Metallurgy, Process control, chemistry.chemical_element, Material properties, Copper, Layer (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c355b3c265fb02e79ead267dff9f303e
https://doi.org/10.1117/12.632504 -
7
المؤلفون: Jin Lu, Thy Tran, Greg Herdt, Nicolai Petrov, Yushi Hu, Vasil Antonov, Dale Collins, Pratap Murali, Zishu Zhang, Sid Kondoju, Sam Ireland
المصدر: ECS Meeting Abstracts. :2505-2505
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8
المؤلفون: Qingyun Chen, Christian Witt, Nicolai Petrov, Charles Valverde, Daniel Stritch, Richard Hurtubise
المصدر: ECS Meeting Abstracts. :417-417
مصطلحات موضوعية: Materials science, chemistry, Metallurgy, Copper interconnect, chemistry.chemical_element, Cobalt, Copper