يعرض 1 - 10 نتائج من 86 نتيجة بحث عن '"Nied, H.F."', وقت الاستعلام: 0.92s تنقيح النتائج
  1. 1
    مؤتمر

    المؤلفون: Pearson, R.A., Ayhan, A., Nied, H.F.

    المصدر: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on. :63-67 2000

    Relation: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

  2. 2
    مؤتمر

    المؤلفون: Ayhan, A.O., Nied, H.F.

    المصدر: ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on. :185-192 1998

    Relation: ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

  3. 3
    دورية أكاديمية

    المؤلفون: Nied, H.F.

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 3(4):129-143 Dec, 2003

  4. 4
    دورية أكاديمية

    المؤلفون: Jongwoo Park, Harlow, D.G., Nied, H.F.

    المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 24(3):482-492 Sep, 2001

  5. 5
    دورية أكاديمية

    المؤلفون: Jongwoo Park, Harlow, D.G., Nied, H.F.

    المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 23(1):100-107 Feb, 2000

  6. 6
    دورية أكاديمية

    المؤلفون: Ayhan, A.O., Nied, H.F.

    المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 22(4):503-511 Dec, 1999

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    دورية أكاديمية
  9. 9
    دورية أكاديمية
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