المؤلفون: Ende, L.^{Aff1, IDs43580022004590_cor1}, Grund, M., Schwarz, U., Preiss, C., Götz, V., Ramasubramanian, S.^{Aff1, Aff2}, Niess, J., Lerch, W.^{Aff4, Aff5}, Scheit, A.

المصدر: MRS Advances. 7(36):1525-1529

المؤلفون: Timans, P.J., Lerch, W., Niess, J., Paul, S., Acharya, N., Nenyei, Z.

المصدر: 11th IEEE International Conference on Advanced Thermal Processing of Semiconductors. RTP 2003 Advanced thermal processing of semiconductors Advanced Thermal Processing of Semiconductors, 2003. RTP 2003. 11th IEEE International Conference on. :17-33 2003

Relation: International Conference on Advanced Thermal Processing of Semiconductors

المؤلفون: Niess, J., Berger, R., Timans, P.J., Nenyei, Z.

المصدر: 10th IEEE International Conference of Advanced Thermal Processing of Semiconductors Advanced thermal processing of semiconductors Advanced Thermal Processing of Semiconductors, 2002. RTP 2002. 10th IEEE International Conference of. :49-57 2002

Relation: 10th IEEE International Conference on Advanced Thermal Processing of Semiconductors - RTP 2002

المؤلفون: Berger, R., Miethaner, S., Gruber, H., Niess, J., Dietl, W., Nenyei, Z.

المصدر: 9th International Conference on Advanced Thermal Processing of Semiconductors, RTP 2001 Advanced thermal processing of semiconductors Advanced Thermal Processing of Semiconductors 9th Internationa Conference on RTP 2001. :71-77 2001

Relation: 9th International Conference on Advanced Thermal Processing of Semiconductors. RTP 2001

المؤلفون: Niess, J., Kirchner, C., Dietl, W., Meyer, H.-J., Nadig, B., Lerch, W., Costina, I., Kurps, R., Bolze, D.

المصدر: 2007 15th International Conference on Advanced Thermal Processing of Semiconductors Advanced Thermal Processing of Semiconductors, 2007. RTP 2007. 15th International Conference on. :209-214 Oct, 2007

Relation: 2007 15th International Conference on Advanced Thermal Processing of Semiconductors

المؤلفون: Lerch, W., Paul, S., Niess, J., McCoy, S., Gelpey, J., Bolze, D., Cristiano, F., Severac, F., Fazzini, P.F., Martinez, A., Pichler, P.

المصدر: 2007 15th International Conference on Advanced Thermal Processing of Semiconductors Advanced Thermal Processing of Semiconductors, 2007. RTP 2007. 15th International Conference on. :191-196 Oct, 2007

Relation: 2007 15th International Conference on Advanced Thermal Processing of Semiconductors

المؤلفون: Lerch, W., Paul, S., Niess, J., Chan, J., McCoy, S., Gelpey, J., Cristiano, F., Severac, F., Fazzini, P. F., Bolze, D., Pichler, P., Martinez, A., Mineji, A., Shishiguchi, S.

المصدر: 2007 International Workshop on Junction Technology Junction Technology, 2007 International Workshop on. :129-134 Jun, 2007

Relation: 2007 International Workshop on Junction Technology

المؤلفون: Nenyei, Z., Niess, J., Lerch, W., Dietl, W., Timans, P. J., Pichler, P.

المصدر: 2006 14th IEEE International Conference on Advanced Thermal Processing of Semiconductors Advanced Thermal Processing of Semiconductors, 2006. RTP '06. 14th IEEE International Conference on. :177-191 Oct, 2006

Relation: 2006 14th IEEE International Conference on Advanced Thermal Processing of Semiconductors

المؤلفون: Huelsmann, T., Niess, J., Lerch, W., Fursenko, O., Bolze, D.

المصدر: 2006 14th IEEE International Conference on Advanced Thermal Processing of Semiconductors Advanced Thermal Processing of Semiconductors, 2006. RTP '06. 14th IEEE International Conference on. :237-242 Oct, 2006

Relation: 2006 14th IEEE International Conference on Advanced Thermal Processing of Semiconductors

المؤلفون: Czernohorsky, M., Seidel, K., Kühnel, K., Niess, J., Sacher, N., Kegel, W., Lerch, W.

المصدر: In Microelectronic Engineering 25 June 2017 178:262-265