المؤلفون: Nilsen, C.B., Hoff, B., Ostrem, T.

المصدر: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society. :3472-3476 Oct, 2018

Relation: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society

المؤلفون: Jain, S., Whalley, D.C., Cottrill, M., Kristiansen, H., Redford, K., Nilsen, C.B., Helland, T., Liu, C.

المصدر: 18th European Microelectronics & Packaging Conference Microelectronics and Packaging Conference (EMPC), 2011 18th European. :1-7 Sep, 2011

Relation: 2011 18th European Microelectronics and Packaging Conference (EMPC)

المؤلفون: Nilsen, C.B., Gregory, C.M., Hatfield, J.V.

المصدر: IEEE Ultrasonics Symposium, 2004 Ultrasonics Symposium Ultrasonics Symposium, 2004 IEEE. 2:1146-1148 Vol.2 2004

Relation: 2004 IEEE Ultrasonics Symposium

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