يعرض 1 - 10 نتائج من 1,124 نتيجة بحث عن '"Ning, Cheng"', وقت الاستعلام: 0.85s تنقيح النتائج
  1. 1
    مؤتمر
    Sip Solder Paste with Superior Slump Resistance via Powder Cluster Mechanism

    المؤلفون: Xu, Zhengfeng, Zheng, Aixia, Wang, Jian, Wang, Ming, Lee, Ning-Cheng

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  2. 2
    مؤتمر
    A Novel Lead-Free Low-Temperature Solder with Excellent Drop-Shock Re-sistance

    المؤلفون: Zhang, Hongwen, Lytwynec, Samuel, Lee, Ning-Cheng, Lim, Sze Pei

    المصدر: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2021 16th International. :112-118 Dec, 2021

    Relation: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  3. 3
    مؤتمر
    Epoxy Flux Prevent Hot Tear at VIPPO Solder Joints

    المؤلفون: Zito, Elaina, Bedner, Dave, Lee, Ning-Cheng

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-6 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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  4. 4
    مؤتمر
    A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop-Shock Resistance

    المؤلفون: Zhang, Hongwen, Lytwynec, Samuel, Wang, Huaguang, Geng, Jie, Mutuku, Francis, Lee, Ning-Cheng

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :643-653 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Methods for Preparing Graphite Sheets with Piercing Treatment to Enhance Vertical Thermal Conduction

    المؤلفون: Li, Yanfang, Li, Meng, Chen, Fen, Fan, Guangyu, Lee, Ning-Cheng

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1399-1404 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  6. 6
    دورية أكاديمية
    Uncharacterized yeast gene YBR238C, an effector of TORC1 signaling in a mitochondrial feedback loop, accelerates cellular aging via HAP4- and RMD9-dependent mechanisms

    المؤلفون: Mohammad Alfatah, Jolyn Jia Jia Lim, Yizhong Zhang, Arshia Naaz, Trishia Yi Ning Cheng, Sonia Yogasundaram, Nashrul Afiq Faidzinn, Jovian Jing Lin, Birgit Eisenhaber, Frank Eisenhaber

    المصدر: eLife, Vol 12 (2024)

    مصطلحات موضوعية: cellular aging, lifespan, nutrient signaling, target of rapamycin complex 1, mitochondria, uncharacterized genes, Medicine, Science, Biology (General), QH301-705.5

    وصف الملف: electronic resource

    Relation: https://elifesciences.org/articles/92178; https://doaj.org/toc/2050-084X

    URL الوصول: https://doaj.org/article/6d69ed0e4b1c4eccb799998c85be894a

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  7. 7
    دورية أكاديمية
    PICLS with human cells is the first high throughput screening method for identifying novel compounds that extend lifespan

    المؤلفون: Mohammad Alfatah, Yizhong Zhang, Arshia Naaz, Trishia Yi Ning Cheng, Frank Eisenhaber

    المصدر: Biology Direct, Vol 19, Iss 1, Pp 1-10 (2024)

    مصطلحات موضوعية: Chronological lifespan, High-throughput methods, Chemical screening, Human cells, 2,5-Anhydro-d-mannitol, Rapamycin, Biology (General), QH301-705.5

    وصف الملف: electronic resource

    Relation: https://doaj.org/toc/1745-6150

    URL الوصول: https://doaj.org/article/e6061c31863549b8ad5d29645c27f527

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  8. 8
    مؤتمر
    Versatile TIM Solution with Chain Network Solder Composite

    المؤلفون: Mao, Runsheng, Chen, Sihai, Zito, Elaina, Bedner, David, Lee, Ning-Cheng

    المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-6 Aug, 2020

    Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    Pressureless Sintering Process of Ag Sinter Paste Bonding Ag Si Die on Bare Cu DBC Using Convection Reflow Oven in Nitrogen for Die Attach

    المؤلفون: Fan, Guangyu, Labarbera, Christine, Lee, Ning-Cheng, Boushie, Zachary, Lockwood, Nicole

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1338-1343 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  10. 10
    دورية أكاديمية
    Knowledge Graph Visualization Interface for Digital Heritage Collections: Design Issues and Recommendations.

    المؤلفون: Khoo, Christopher S. G., Tan, Eleanor A. L., Siam-Gek Ng, Chwee-Fong Chan, Stanley-Baker, Michael, Wei-Ning Cheng

    المصدر: Information Technology & Libraries; Mar2024, Vol. 43 Issue 1, p1-26, 26p

    مصطلحات موضوعية: INTELLECT, INTERNET searching, ARCHIVES, MEDICAL informatics, INFORMATION technology, COMPUTER graphics, SEARCH engines, METADATA, HUMANITIES, SOCIAL networks, SOFTWARE architecture, DIGITAL libraries, USER interfaces

    مصطلحات جغرافية: SINGAPORE

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