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1دورية أكاديمية
المؤلفون: Ning, T.H.
المصدر: IEEE Electron Devices Magazine IEEE Electron Devices Mag. Electron Devices Magazine, IEEE. 1(1):33-40 Jun, 2023
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2دورية أكاديمية
المؤلفون: Yau, J., Cai, J., Ning, T.H.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 63(5):1835-1839 May, 2016
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3مؤتمر
المؤلفون: Tianhing Chen, Bellini, M., Zhao, E., Comeau, J.P., Sutton, A.K., Grens, C.M., Cressler, J.D., Jin Cai, Ning, T.H.
المصدر: Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, 2005. Biopolar/BiCMOS Circuits and Technology Bipolar/BiCMOS Circuits and Technology Meeting, 2005. Proceedings of the. :256-259 2005
Relation: Proceedings of the 2005 Biopolar/BiCMOS Circuits and Technology Meeting
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4مؤتمر
المؤلفون: Jin Cai, Ning, T.H.
المصدر: Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. Solid-state and integrated circuits technology Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on. 3:2102-2107 vol.3 2004
Relation: 2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings
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5مؤتمر
المؤلفون: Ning, T.H.
المصدر: 2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407) VLSI technology VLSI Technology, 2003. Digest of Technical Papers. 2003 Symposium on. :5-8 2003
Relation: 2003 Symposium on VLSI Technology. Digest of Technical Papers
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6مؤتمر
المؤلفون: Ning, T.H.
المصدر: Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the. :1-4 2003
Relation: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
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7مؤتمر
المؤلفون: Ning, T.H.
المصدر: 2003 International Symposium on VLSI Technology, Systems and Applications. Proceedings of Technical Papers. (IEEE Cat. No.03TH8672) VLSI technology, systems and applications VLSI Technology, Systems, and Applications, 2003 International Symposium on. :121-124 2003
Relation: 2003 International Symposium on VLSI Technology, Systems and Applications. Proceedings of Technical Papers
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8مؤتمر
المؤلفون: Ning, T.H.
المصدر: 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059) Reliability physics Reliability Physics Symposium, 2000. Proceedings. 38th Annual 2000 IEEE International. :1-6 2000
Relation: 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual
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9مؤتمر
المؤلفون: Ning, T.H.
المصدر: Proceedings of the IEEE 2000 Custom Integrated Circuits Conference (Cat. No.00CH37044) Custom integrated circuits Custom Integrated Circuits Conference, 2000. CICC. Proceedings of the IEEE 2000. :49-56 2000
Relation: Proceedings of the IEEE 2000 Custom Integrated Circuits Conference
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10دورية أكاديمية
المؤلفون: Hashemi, P., Yau, J., Chan, K.K., Ning, T.H., Shahidi, G.G.
المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 6:537-542 2018