المؤلفون: Anderson, Cameron, Fan, Z. Hugh, Richstein, Jorg, Sussman, Mark, Nishida, Toshikazu

المصدر: 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2023 IEEE International Conference on. :1-4 Jul, 2023

Relation: 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

المؤلفون: Perello-Roig, Rafel, Verd, Jaume, Bota, Sebastia, Nishida, Toshikazu, Segura, Jaume

المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :144-147 Jun, 2023

Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

المؤلفون: Sondhi, Kartik, Reddy Avuthu, Sai Guruva, Richards, Nathaniel, Fan, Z. Hugh, Nishida, Toshikazu

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1542-1547 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Smith, Connor S., Sondhi, Kartik, Jimenez, Beatriz, Fan, Z. Hugh, Nishida, Toshikazu, Arnold, David P.

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :2325-2329 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Ghatge, Mayur, Walters, Glen, Nishida, Toshikazu, Tabrizian, Roozbeh

المصدر: 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2020 IEEE 33rd International Conference on. :953-956 Jan, 2020

Relation: 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Ghatge, Mayur, Walters, Glen, Nishida, Toshikazu, Tabrizian, Roozbeh

المصدر: 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), 2019 20th International Conference on. :446-449 Jun, 2019

Relation: 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

المؤلفون: Ghatge, Mayur, Walters, Glen, Nishida, Toshikazu, Tabrizian, Roozbeh

المصدر: 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2019 IEEE 32nd International Conference on. :292-295 Jan, 2019

Relation: 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Bhanvadia, Aftab A., Farley, Richard T., Noh, Youngwook, Nishida, Toshikazu^{Aff1, IDs4159802226684z_cor4}

المصدر: Scientific Reports. 13(1)

المؤلفون: Amontree, Jacob, Sondhi, Kartik, Hwangbo, Seahee, Reddy Avuthu, Sai Guruva, Yoon, Yong-Kyu, Nishida, Toshikazu, Fan, Z. Hugh

المصدر: 2018 6th IEEE International Conference on Wireless for Space and Extreme Environments (WiSEE) Wireless for Space and Extreme Environments (WiSEE), 2018 6th IEEE International Conference on. :119-124 Dec, 2018

Relation: 2018 6th IEEE International Conference on Wireless for Space and Extreme Environments (WiSEE)

المؤلفون: Sondhi, Kartik, Amontree, Jacob, Hwangbo, Seahee, Avuthu, Sai Guruva Reddy, Yoon, Yong-Kyu, Fan, Z. Hugh, Nishida, Toshikazu

المصدر: 2018 IEEE SENSORS SENSORS, 2018 IEEE. :1-4 Oct, 2018

Relation: 2018 IEEE SENSORS