المؤلفون: Putaala, J., Hagberg, J., Kangasvieri, T., Raumanni, J., Salmela, O., Rahko, M., Jaaskelainen, J., Galkin, T., Nousiainen, O., Jantunen, H.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 19(3):484-493 Sep, 2019

المؤلفون: Anttonen, J., Kangasvieri, T., Nousiainen, O., Putaala, J., Vahakangas, J.

المصدر: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on. :1-4 2006

Relation: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems

المؤلفون: Putaala, J., Salmela, O., Nousiainen, O., Kangasvieri, T., Uusimaki, A.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(6):994-1001 Jun, 2012

المؤلفون: Putaala, J., Nousiainen, O., Komulainen, M., Kangasvieri, T., Jantunen, H., Moilanen, M.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(9):1465-1472 Sep, 2011

المؤلفون: Putaala, J., Kangasvieri, T., Nousiainen, O., Jantunen, H., Moilanen, M.

المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 31(3):240-247 Jul, 2008

المؤلفون: Putaala, J., Nousiainen, O., Jantunen, H., Moilanen, M.

المصدر: 2006 1st Electronic Systemintegration Technology Conference Electronics Systemintegration Technology Conference, 2006. 1st. 1:35-40 Sep, 2006

Relation: 2006 1st Electronic Systemintegration Technology Conference

المؤلفون: Nousiainen, O. (Olli), Hannula, J. (Jaakko), Saukko, S. (Sami), Kaijalainen, A. (Antti), Kömi, J. (Jukka)

مصطلحات موضوعية: Advanced high strength steels (AHSS), Scanning/transmission electron microscopy (STEM), Isothermal heat treatments, Interphase precipitation

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od______2423::2e1a2815e6c6685475c575e51cff21a0
http://urn.fi/urn:nbn:fi-fe2023042839343

المؤلفون: Nousiainen, O., Salmela, O., Putaala, J., Kangasvieri, T.

المصدر: Soldering & Surface Mount Technology, 2011, Vol. 23, Issue 2, pp. 104-114.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/09540911111120177

المؤلفون: Nousiainen, O., Kangasvieri, T., Rautioaho, R., Vähäkangas, J.

المصدر: Soldering & Surface Mount Technology, 2011, Vol. 23, Issue 1, pp. 30-39.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/09540911111099686

المؤلفون: Nousiainen, O., Kangasvieri, T., Kautio, K., Rautioaho, R., Vähäkangas, J.

المصدر: Soldering & Surface Mount Technology, 2010, Vol. 22, Issue 3, pp. 22-35.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/09540911011054163