المؤلفون: Barton, J., Lynch, A., Bellis, S., O'Flynn, B., Murphy, F., Delaney, K., O'Mathuna, S.C., Repetto, P., Finizio, R., Carvignese, C., Liotti, L.

المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :1402-1406 2005

Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference

المؤلفون: O'Flynn, B., Bellis, S., Delaney, K., Barton, J., O'Mathuna, S.C., Barroso, A.M., Benson, J., Roedig, U., Sreenan, C.

المصدر: IPSN 2005. Fourth International Symposium on Information Processing in Sensor Networks, 2005. Microelectronics and electron devices Information Processing in Sensor Networks, 2005. IPSN 2005. Fourth International Symposium on. :370-375 2005

Relation: 2005 IEEE Workshop on Microelectronics and Electron Devices

المؤلفون: O'Donnell, T., Chevalerais, O., Grant, G., O'Mathuna, S.C., Power, D., O'Donnovan, N.

المصدر: Twentieth Annual IEEE Applied Power Electronics Conference and Exposition, 2005. APEC 2005. Applied Power Electronics Applied Power Electronics Conference and Exposition, 2005. APEC 2005. Twentieth Annual IEEE. 3:2024-2029 Vol. 3 2005

Relation: APEC 2005. Twentieth Annual IEEE Applied Power Electronics Conference and Exposition

المؤلفون: Majeed, B., Van Sinte Jans, J.-B., Paul, I., Barton, J., O'Mathuna, S.C., Delaney, K.

المصدر: Research in Microelectronics and Electronics, 2005 PhD Microelectronics and Electronics Research in Microelectronics and Electronics, 2005 PhD. 1:237-240 vol.1 2005

Relation: 2005 PhD Research in Microelectronics and Electronics

المؤلفون: Barton, J., Lynch, A., Bellis, S., O'Flynn, B., Mahmood, K., Delaney, K., O'Mathuna, S.C.

المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :586-589 2004

Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)

المؤلفون: Ludwig, M., Gaedke, A., Slattery, O., Flannery, J., O'Mathuna, S.C.

المصدر: ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on. 2:378-384 vol. 2 2000

Relation: ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

المؤلفون: Ludwig, M., Gaedke, A., Slattery, O., Flannery, J., O'Mathuna, S.C.

المصدر: 2000 IEEE 31st Annual Power Electronics Specialists Conference. Conference Proceedings (Cat. No.00CH37018) Power electronics Power Electronics Specialists Conference, 2000. PESC 00. 2000 IEEE 31st Annual. 3:1612-1617 vol.3 2000

Relation: Proceedings of the 2000 Power Electronics Specialist Conference

المؤلفون: Flannery, J., Cheasty, P., Meinhardt, M., Ludwig, M., Leonavicius, V., O'Mathuna, S.C., Alderman, A.

المصدر: 2000 IEEE 31st Annual Power Electronics Specialists Conference. Conference Proceedings (Cat. No.00CH37018) Power electronics Power Electronics Specialists Conference, 2000. PESC 00. 2000 IEEE 31st Annual. 1:41-46 vol.1 2000

Relation: Proceedings of the 2000 Power Electronics Specialist Conference

المؤلفون: Flannery, J., Meinhardt, M., Cheasty, P., Byrne, P., O'Mathuna, S.C., Slattery, O., Briggs, K., Barrass, P., Drury, B.

المصدر: APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285) Applied power electronics Applied Power Electronics Conference and Exposition, 1999. APEC '99. Fourteenth Annual. 2:657-663 vol.2 1999

Relation: Proceedings of APEC '99 - Applied Power Electronics Conference

المؤلفون: Meere, R., O'Donnell, T., Bergveld, H.J., Wang , N., O'Mathuna, S.C.

المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 24(9):2212-2218 Sep, 2009