-
1
المؤلفون: Erick Franieck, Martin Schneider-Ramelow, O. Holck, Martin Fleischmann
المصدر: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
مصطلحات موضوعية: Materials science, business.industry, Electronic packaging, Dielectric, Molding (process), Epoxy, chemistry.chemical_compound, chemistry, visual_art, Silicon carbide, visual_art.visual_art_medium, Cure monitoring, Ceramic, Process engineering, business, Curing (chemistry)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cb9f4e90026c0de2210b01a9aecec65a
https://doi.org/10.23919/empc53418.2021.9584963 -
2
المؤلفون: Jean Trewhella, Thi Huyen Le, Karl-Friedrich Becker, Daniel Berger, Mathias Bottcher, Tanja Braun, O. Holck, Michael Schiffer, Ivan Ndip, Marcel Wieland, Martin Schneider-Ramelow, Marco Rossi, Friedrich Muller, Marcus Voitel, Rolf Aschenbrenner, Christian Goetze
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Patch antenna, Materials science, Packaging engineering, business.industry, Integrated circuit, Electrical connection, law.invention, law, Optoelectronics, Wafer dicing, Wafer, Antenna (radio), business, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3afeab3c60f3fa9462b85606d5a42d07
https://doi.org/10.1109/ectc32696.2021.00317 -
3
المؤلفون: Tanja Braun, Steve Voges, K.-F. Becker, Martin Schneider-Ramelow, R. Kahle, K-D. Lang, O. Holck, Marc Dreissigacker, J. Bauer, Rolf Aschenbrenner
المصدر: 2019 International Wafer Level Packaging Conference (IWLPC).
مصطلحات موضوعية: Wafer-scale integration, Packaging engineering, business.industry, Computer science, Automotive engineering, law.invention, Capacitor, Material selection, law, System integration, Power Management Unit, business, Wireless sensor network, Energy harvesting
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d507048d2bdcb3012702fbab56321ec8
https://doi.org/10.23919/iwlpc.2019.8914021 -
4
المؤلفون: Tanja Braun, Hans Walter, M. Huhn, Matthias Wietstruck, Andreas Mai, Mehmet Kaynak, K-D. Lang, O. Holck, S. Raatz, K.-F. Becker, U. Maass, Michael Topper, R. F. Scholz, S. Voges, M. van Dijk, Markus Wohrmann, Rolf Aschenbrenner
المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Engineering, business.industry, Electrical engineering, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Wafer backgrinding, Embedded Wafer Level Ball Grid Array, System in package, Die preparation, Chip-scale package, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Wafer testing, Wafer dicing, 0210 nano-technology, business, Wafer-level packaging
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::da90e3bb75231af8eb5d74593ece1cfc
https://doi.org/10.1109/ectc.2017.230 -
5
المؤلفون: Bernhard Wunderle, Jörg Bauer, Klaus-Dieter Lang, O. Holck, Hans Walter, Tanja Braun, Olaf Wittler
المصدر: Microelectronics Reliability. 53:1111-1116
مصطلحات موضوعية: Work (thermodynamics), Materials science, Molecular model, Moisture, Analytical chemistry, Epoxy, Molding (process), Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Molecular dynamics, Chemical physics, visual_art, visual_art.visual_art_medium, Molecule, Electrical and Electronic Engineering, Diffusion (business), Safety, Risk, Reliability and Quality
-
6
المؤلفون: O. Holck, Tanja Braun, Tom Dobs, Marcus Schulz, Stephan Benecke, Ingolf Schlosser, Olaf Wittler, V. Bader, Francisco Vergara, J. Keller, Klaus-Dieter Lang, Marius van Dijk, Talat Yacoub, Paul Bittner
المصدر: 2016 6th Electronic System-Integration Technology Conference (ESTC).
مصطلحات موضوعية: Vibration, Engineering, Relation (database), business.industry, Electric potential energy, Systems design, Control engineering, Energy supply, business, Piezoelectricity, Reliability (statistics), Automotive engineering, Energy (signal processing)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f6858c7badfb781c56cd8241338e917e
https://doi.org/10.1109/estc.2016.7764702 -
7
المؤلفون: Hans Walter, O. Holck, O. Wittler, M. van Dijk, J. Bauer, K-D. Lang
المصدر: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
مصطلحات موضوعية: 010302 applied physics, Work (thermodynamics), Materials science, Isotropy, 02 engineering and technology, Epoxy, 021001 nanoscience & nanotechnology, Thermal diffusivity, 01 natural sciences, Molecular dynamics, Volume (thermodynamics), visual_art, 0103 physical sciences, visual_art.visual_art_medium, Adhesive, Composite material, 0210 nano-technology, Electrical conductor
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::96d9ea7ba3ef915e38bc1a696c07313f
https://doi.org/10.1109/eurosime.2016.7463346 -
8
المؤلفون: Olaf Wittler, Jörg Bauer, O. Holck, Bernhard Wunderle, Bernd Michel
المصدر: Microelectronics Reliability. 52:1285-1290
مصطلحات موضوعية: Materials science, Chemical substance, Silicon dioxide, Epoxy, Molding (process), Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Characterization (materials science), Contact angle, chemistry.chemical_compound, chemistry, visual_art, visual_art.visual_art_medium, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, Science, technology and society, Layer (electronics)
-
9
المؤلفون: O. Holck, Bernhard Wunderle
المصدر: Molecular Modeling and Multiscaling Issues for Electronic Material Applications ISBN: 9783319128610
مصطلحات موضوعية: Materials science, business.industry, Delamination, Mechanical engineering, Nanotechnology, Surface finish, Epoxy, Finite element method, System in package, visual_art, Physics of failure, visual_art.visual_art_medium, Microelectronics, business, Microscale chemistry
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::617bfe764b34add0d409d24026e05ad3
https://doi.org/10.1007/978-3-319-12862-7_4 -
10
المؤلفون: Peggy John, Mathias Bottcher, K-D. Lang, Olaf Wittler, M. J. Wolf, Arian Grams, Conny Fiedler, Hans Walter, M. Nuss, O. Holck, T. Prewitz
المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Silicon, chemistry, Electronic engineering, chemistry.chemical_element, Mechanical engineering, Elasticity (economics), Finite element method, Grain size, Electron backscatter diffraction
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::84da27dbe243d28f3ce1100ce4753459
https://doi.org/10.1109/ectc.2014.6897351