المؤلفون: Zhou, H., Ocker, J., Muller, S., Pesic, M., Mikolajick, T.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 44(11):1903-1906 Nov, 2023

المؤلفون: Mulaosmanovic, H., Muller, F., Lederer, M., Ali, T., Hoffmann, R., Seidel, K., Zhou, H., Ocker, J., Mueller, S., Dunkel, S., Kleimaier, D., Muller, J., Trentzsch, M., Beyer, S., Breyer, E.T., Mikolajick, T., Slesazeck, S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 67(8):3466-3471 Aug, 2020

المؤلفون: Muller, S., Zhou, H., Benoist, A., Ocker, J., Noack, M., Kuzmanov, G., Iqbal, R., Le Minh, D., Ghazaryan, M., Anjaneyamoorthi, V., Daraghmah, A., Mennenga, M., Koushan, F., Tassan, F., Dunkel, S., Muller, J., Beyer, S., Soss, S., Pourkeramati, A.

المصدر: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021

Relation: 2021 Symposium on VLSI Technology

المؤلفون: Zhou, H., Ocker, J., Pesic, M., Padovani, A., Trentzsch, M., Dunkel, S., Muller, J., Beyer, S., Larcher, L., Koushan, F., Muller, S., Mikolajick, T.

المصدر: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021

Relation: 2021 Symposium on VLSI Technology

المؤلفون: Muller, J., Polakowski, P., Muller, S., Mulaosmanovic, H., Ocker, J., Mikolajick, T., Slesazeck, S., Flachowsky, S., Trentzsch, M.

المصدر: 2016 16th Non-Volatile Memory Technology Symposium (NVMTS) Non-Volatile Memory Technology Symposium (NVMTS), 2016 16th. :1-7 Oct, 2016

Relation: 2016 16th Non-Volatile Memory Technology Symposium (NVMTS)

المؤلفون: Schroeder, U., Pesic, M., Schenk, T., Mulaosmanovic, H., Slesazeck, S., Ocker, J., Richter, C., Yurchuk, E., Khullar, K., Muller, J., Polakowski, P., Grimley, E. D., LeBeau, J. M., Flachowsky, S., Jansen, S., Kolodinski, S., van Bentum, R., Kersch, A., Kunneth, C., Mikolajick, T.

المصدر: 2016 46th European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), 2016 46th European. :364-368 Sep, 2016

Relation: ESSDERC 2016 - 46th European Solid-State Device Research Conference

المؤلفون: Zhou, H., Ocker, J., Padovani, A., Pesic, M., Trentzsch, M., Dunkel, S., Mulaosmanovic, H., Slesazeck, S., Larcher, Luca, Beyer, S., Muller, S., Mikolajick, T.

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :18.6.1-18.6.4 Dec, 2020

Relation: 2020 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Ocker, J., Slesazeck, S., Hoffmann, R., Beyer, V., Skouris, A., Srowik, R., Buschbeck, S., Gunther, S., Mikolajick, T.

المصدر: 2015 IEEE International Integrated Reliability Workshop (IIRW) Integrated Reliability Workshop (IIRW), 2015 IEEE International. :13-16 Oct, 2015

Relation: 2015 IEEE International Integrated Reliability Workshop (IIRW)

المؤلفون: Ocker, J., Slesazeck, S., Mikolajick, T., Buschbeck, S., Gunther, S., Yurchuk, E., Hoffmann, R., Beyer, V.

المصدر: 2015 45th European Solid State Device Research Conference (ESSDERC) Solid State Device Research Conference (ESSDERC), 2015 45th European. :118-121 Sep, 2015

Relation: ESSDERC 2015 - 45th European Solid-State Device Research Conference

المؤلفون: Ocker, J., Kupke, S., Slesazeck, S., Mikolajick, T., Erben, E., Drescher, M., Naumann, A., Lazarevic, F., Leitsmann, R.

المصدر: 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International. :86-89 Oct, 2014

Relation: 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW)