المؤلفون: Emersic, Z., Ohki, T., Akasaka, M., Arakawa, T., Maeda, S., Okano, M., Sato, Y., George, A., Marcel, S., Ganapathi, I.I., Ali, S.S., Javed, S., Werghi, N., Isik, S.G., Saritas, E., Ekenel, H.K., Hudovernik, V., Kolf, J.N., Boutros, F., Damer, N., Sharma, G., Kamboj, A., Nigam, A., Jain, D.K., Camara-Chavez, G., Peer, P., Struc, V.

المصدر: 2023 IEEE International Joint Conference on Biometrics (IJCB) Biometrics (IJCB), 2023 IEEE International Joint Conference on. :1-10 Sep, 2023

Relation: 2023 IEEE International Joint Conference on Biometrics (IJCB)

المؤلفون: Kotani, J., Yaita, J., Homma, K., Ozaki, S., Yamada, A., Sato, M., Ohki, T., Nakamura, N.

المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 11:101-106 2023

المؤلفون: Nagulu, A., Ranzani, L. M., Riebell, G. J., Gustafsson, M. V., Ohki, T. A., Krishnaswamy, H.

المصدر: 2023 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2023 IEEE. :1-2 Apr, 2023

Relation: 2023 IEEE Custom Integrated Circuits Conference (CICC)

المؤلفون: Kumazaki, Y., Ozaki, S., Okamoto, N., Hara, N., Ohki, T.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(6):3073-3078 Jun, 2022

المؤلفون: Okamoto, N., Sato, M., Nishimori, M., Kumazaki, Y., Ohki, T., Hara, N., Watanabe, K.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(11):1909-1916 Nov, 2021

المؤلفون: Niida, Y., Sato, M., Ohki, T., Nakamura, N.

المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 69(3):1675-1683 Mar, 2021

المؤلفون: Govia, L. C. G., Ribeill, G. J., Rowlands, G. E., Ohki, T. A.

مصطلحات موضوعية: Quantum Physics, Condensed Matter - Disordered Systems and Neural Networks

URL الوصول: http://arxiv.org/abs/2107.00147

المؤلفون: Riste, D., Fallek, S., Donovan, B., Ohki, T.

المصدر: IEEE Microwave Magazine IEEE Microwave Microwave Magazine, IEEE. 21(8):60-71 Aug, 2020

المؤلفون: Kalfus, W. D., Ribeill, G. J., Rowlands, G. E., Krovi, H. K., Ohki, T. A., Govia, L. C. G.

مصطلحات موضوعية: Quantum Physics

URL الوصول: http://arxiv.org/abs/2101.11729

المؤلفون: Ohki, T., Yamada, A., Minoura, Y., Makiyama, K., Kotani, J., Ozaki, S., Sato, M., Okamoto, N., Joshin, K., Nakamura, N.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 40(2):287-290 Feb, 2019