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1دورية أكاديمية
المؤلفون: Greif, R, Bhanji, F, Bigham, BL, Bray, J, Breckwoldt, J, Cheng, A, Duff, JP, Gilfoyle, E, Hsieh, MJ, Iwami, T, Lauridsen, KG, Lockey, AS, Ma, MHM, Monsieurs, KG, Okamoto, D, Pellegrino, JL, Yeung, J, Finn, JC
المصدر: Circulation. 142(16_suppl_1):S222-S283
مصطلحات موضوعية: Medicin och hälsovetenskap
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2دورية أكاديمية
المؤلفون: Sato A, Itcho N, Ishiguro H, Okamoto D, Kobayashi N, Kawai K, Kasai H, Kurioka D, Uemura H, Kubota Y, Watanabe M
المصدر: International Journal of Nanomedicine, Vol 2013, Iss default, Pp 3151-3160 (2013)
مصطلحات موضوعية: Medicine (General), R5-920
وصف الملف: electronic resource
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3دورية أكاديمية
المؤلفون: Okamoto, D., Suzuki, Y., Takemura, K., Fujikata, J., Nakamura, T.
المصدر: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 34(3):189-192 Feb, 2022
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4مؤتمر
المؤلفون: Borges Lopes, C.R., Rodrigues de Oliveira Silva, F., Ferrari, V.B., Noma Okamoto, D., De Vasconcelos, S.P., Coronato Courrol, L.
المصدر: 2019 SBFoton International Optics and Photonics Conference (SBFoton IOPC) Photonics Conference (SBFoton IOPC), 2019 SBFoton International Optics and. :1-5 Oct, 2019
Relation: 2019 SBFoton International Optics and Photonics Conference (SBFoton IOPC)
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5دورية أكاديمية
المؤلفون: Ali, M., Watanabe, A.O., Lin, T., Okamoto, D., Pulugurtha, M.R., Tentzeris, M.M., Tummala, R.R.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(9):1515-1523 Sep, 2020
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6دورية أكاديمية
المؤلفون: Dwarakanath, S., Kakutani, T., Okamoto, D., Raj, P.M., Swaminathan, M., Tummala, R.R.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(9):1552-1559 Sep, 2020
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7مؤتمر
المؤلفون: Okamoto, D., Shibasaki, Y., Shibata, D., Hanada, T., Liu, F., Sundaram, V., Tummala, R.R.
المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1543-1548 May, 2018
Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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8مؤتمر
المؤلفون: Okamoto, D., Suzuki, Y., Fujikata, J., Tokushima, M., Ushida, J., Horikawa, T., Takemura, K., Nakamura, T., Hagihara, Y., Yashiki, K., Kurihara, M., Kinoshita, K., Kurata, K.
المصدر: 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020
Relation: 2020 IEEE Symposium on VLSI Technology
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9مؤتمر
المؤلفون: Gonsioroski, L. H., de Almeida, M. P. C, Castellanos, P. V. G., Okamoto, D. M., Arnez, J. J. A., Souza, R.S.L., da Silva Mello, L.
المصدر: 2014 International Telecommunications Symposium (ITS) Telecommunications Symposium (ITS), 2014 International. :1-5 Aug, 2014
Relation: 2014 International Telecommunications Symposium (ITS)
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10مؤتمرAdvanced devices and packaging of Si-photonics-based optical transceiver for optical interconnection
المؤلفون: Kurata, K., Yashiki, K., Fujikata, J., Horikawa, T., Kinoshita, K., Ushida, J., Tokushima, M., Suzuki, Y., Okamoto, D., Takahashi, S., Ukita, A., Takemura, K., Ibusuki, Y., Shimizu, T., Kurihara, M., Hagihara, Y., Mogami, T., Nakamura, T.
المصدر: 2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :34.4.1-34.4.4 Dec, 2017
Relation: 2017 IEEE International Electron Devices Meeting (IEDM)
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